Inventor
CHIA-CHAN CHEN
Inventor
TW
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Fprimary
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation33%
H01LSemiconductor devices24%
H04NPictorial communication, e.g. television9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light7%
H10DInorganic electric semiconductor devices7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
Y02PClimate change mitigation technologies in the production or processing of goods7%
PatentTitleYear
12,550,468Photo-sensing device and manufacturing method thereof202612,507,491—202512,408,456Image sensor pixel and metal shielding of charge storage device of image sensor pixel formed by one step process202512,363,459Photosensing pixel including self-aligned light shielding layer202512,317,639Optical sensing device having inclined reflective surface202512,300,713Image sensor having lens layer over optical sensing area and manufacturing method thereof202512,218,260Optical sensing device having inclined reflective surface202512,113,079Image sensor with shallow trench edge doping202412,046,614Apparatus and methods for effective impurity gettering202411,735,609Image sensor with shallow trench edge doping202311,728,362Image sensor pixel and metal shielding of charge storage device of image sensor pixel formed by one step process202311,552,205Optical sensing device having inclined reflective surface202311,398,512Photo-sensing device and manufacturing method thereof202211,380,729Image sensor having lens layer and manufacturing method thereof202211,158,591Bond pad structure for bonding improvement202111,139,212Semiconductor arrangement and method for making2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (16)· patent assignee history
2021–2026Based in TW· patent location history
2025Patents assigned to TAIWAN SEMICONDUCTOR MANUFACTORING COMPANY LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 16 | 2021–2026 |
| TAIWAN SEMICONDUCTOR MANUFACTORING COMPANY LTD | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 16 | 2021–2026 |