Inventor

Quim MUNTAL DIAZ

Inventor

Overview

4→

Patents

2022–2024

Patent span

Performing operations

Primary field (CPC B)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary

B29CShaping or joining of plastics27%

B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering27%

G06FElectric digital data processing13%

H04NPictorial communication, e.g. television13%

G01BMeasuring length, thickness or similar linear dimensions7%

G05BControl or regulating systems in general7%

G06TImage data processing or generation, in general7%

PatentTitleYear

12,109,761Geometrical compensation in additive manufacturing2024 11,993,022Separation of objects for additive manufacturing2024 11,954,413Evaluating candidate virtual build volumes2024 11,348,313Arranging three-dimensional models2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2024Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (4)· patent assignee history

2022–2024Based in ES· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HEWLETT PACKARD DEVELOPMENT CO	4	2022–2024

Locations

Location	Patents	Span
ES	4	2022–2024