Inventor

Keiji Okumura

Inventor

Osaka, JP

Overview

1991–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 60 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices19%

H10DInorganic electric semiconductor devices17%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%

B65HHandling thin or filamentary material, e.g. sheets, webs, cables9%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%

G03GElectrography8%

H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems7%

B42CBookbinding4%

H05KPrinted circuits3%

H04NPictorial communication, e.g. television2%

PatentTitleYear

11,114,560Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor device2021 11,063,123Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor device2021 10,840,369Semiconductor device and method of manufacturing same2020 10,840,340Silicon carbide semiconductor device and silicon carbide semiconductor circuit device2020 10,833,189Semiconductor device2020 10,777,677Insulated gate semiconductor device and method of manufacturing same2020 10,777,678Semiconductor device2020 10,727,318Semiconductor device VDMOS having a gate insulating film having a high dielectric constant portion contacting the drift region for relaxing an electric field generated in the gate insulating film2020 10,686,066Semiconductor device and method of manufacturing same2020 10,672,874Insulated-gate semiconductor device and method of manufacturing the same2020 10,600,864Semiconductor device2020 10,559,552Semiconductor device comprising PN junction diode and Schottky barrier diode2020 10,529,848Insulated-gate semiconductor device and method of manufacturing the same2020 10,490,633Insulated-gate semiconductor device and method of manufacturing the same2019 10,483,390Insulated gate semiconductor device and method of manufacturing same2019 10,468,509Semiconductor device and method of manufacturing semiconductor device2019 10,236,372Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor device2019 10,164,021Silicon carbide semiconductor device2018 10,074,634Semiconductor device comprising PN junction diode and schottky barrier diode2018 10,009,491Image formation apparatus2018 10,002,952Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor device2018 9,916,076'Endoscopic image display device'2018 9,917,074'Semiconductor device comprising PN junction diode and schottky barrier diode'2018 9,679,877'Semiconductor device comprising PN junction diode and Schottky barrier diode'2017 9,494,910'Image forming apparatus comprising board holding member configured to have surface to which board is fixed'2016 9,461,021'Electronic circuit comprising PN junction and schottky barrier diodes'2016 9,454,129'Image forming apparatus composing one face of exterior cover by partly overlapping cover boards'2016 9,442,452'Image forming apparatus comprising connecting mechanism configured to electrically connect high-voltage board and unit'2016 9,434,560'Sheet feeder and image forming apparatus'2016 9,379,634'Semiconductor device'2016 9,245,956'Electronic circuit comprising unipolar and bipolar devices'2016 9,207,620'Combined units and image forming system'2015 9,142,542'Semiconductor device with protective diode'2015 9,136,378'Semiconductor device and manufacturing method for same'2015 9,099,331'Semiconductor device'2015 8,995,030'Image forming apparatus'2015 8,982,204'Inspection management apparatus, system, and method, and computer readable recording medium'2015 8,971,044'Semiconductor device'2015 8,970,020'Semiconductor device'2015 8,844,921'Sheet post-processing device, and image forming apparatus including sheet post-processing device'2014 8,608,150'Sheet post-processing apparatus with branched holding path'2013 8,592,986'High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor device'2013 8,513,806'Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device'2013 8,208,260'Semiconductor device'2012 8,152,159'Sheet feeding device and image forming apparatus including a controlled elevator mechanism'2012 7,938,396'Sheet feeding device and image forming apparatus including sheet feeding device with a sheet feeding preparation period'2011 7,883,084'Sheet feeding device and image forming apparatus with warm air unit for blowing air toward upper face of sheet stack'2011 7,864,533'Semiconductor device'2011 7,823,876'Sheet feeding device and image forming apparatus including sheet feeding device with rear end detection portion'2010 7,773,381'Semiconductor device'2010 7,732,917'Power module'2010 7,434,797'Recording media processing device and image forming device'2008 6,353,727'Image forming apparatus having staple processing section'2002 6,315,288'Sheet post-processing apparatus'2001 6,089,558'Sheet handling unit after image formation'2000 5,653,573'Sheet bundle discharge-handling and guided stowing mechanism'1997 5,465,947'Apparatus for discharging sheets from a sorter'1995 5,452,887'Sorter for an image forming apparatus'1995 5,407,186'Sheet finish-processing unit in image forming apparatus'1995 4,998,716'Sorter with jam-preventing members'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1995–2018Based in Osaka, JP· patent location history

2000–2012Patents assigned to KYOCERA MITA CORP (8)· patent assignee history

2010–2020Patents assigned to ROHM CO LTD (19)· patent assignee history

2010–2020Based in Kyoto, JP· patent location history

2012–2016Patents assigned to OKUMURA KEIJI (10)· patent assignee history

2013–2018Patents assigned to KYOCERA DOCUMENT SOLUTIONS INC (9)· patent assignee history

2015–2018Based in Tokyo, JP· patent location history

2018–2021Patents assigned to FUJI ELECTRIC CO LTD (17)· patent assignee history

2018–2021Based in Matsumoto, JP· patent location history

2018–2020Based in Nagano, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
ROHM CO LTD	19	2010–2020
FUJI ELECTRIC CO LTD	17	2018–2021
OKUMURA KEIJIself	10	2012–2016
KYOCERA DOCUMENT SOLUTIONS INC	9	2013–2018
KYOCERA MITA CORP	8	2000–2012

Locations

Location	Patents	Span
Osaka, JP	21	1995–2018
Kyoto, JP	19	2010–2020
Matsumoto, JP	10	2018–2021
Nagano, JP	7	2018–2020
Tokyo, JP	2	2015–2018