Inventor

Kunimasa Kamio

Inventor

Suita, JP

Overview

1978–1995

Patent span

Chemistry

Primary field (CPC C)

Patents· 30 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C08Gprimary

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds33%

C08LCompositions of macromolecular compounds16%

C07DHeterocyclic compounds11%

C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds6%

H05KPrinted circuits6%

C08JWorking-up5%

C07CAcyclic or carbocyclic compounds4%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%

Y10TTechnical subjects covered by former us classification4%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%

PatentTitleYear

5,478,871'Polyhydric phenol from naphthaldehyde and epoxy resin obtained using the same'1995 5,399,715'Polyamino oligomers and polymaleimide compounds'1995 5,329,047'Aromatic allyl amine thermosetting resin composition'1994 5,300,592'Thermosetting resin composition and a composite material comprising cured product and said resin composition and its matrix'1994 5,109,087'Aromatic allyl amine thermosetting resin composition'1992 5,041,507'Thermosetting resin composition composed of a polymaleimide compound, a phenolic novolac resin and an epoxy resin'1991 4,980,436'Thermosetting resin composition from alkenyl aryloxy triazine compound and poly maleimide'1990 4,960,860'Imide compound and composition containing the same'1990 4,957,995'Low-viscosity epoxy resin, and fiber-reinforced composite material based on m-alkyl triglycidylaminophenols'1990 4,931,515'Method for producing encapsulated semiconductor from improved epoxy resins'1990 4,913,697'Thermosetting resin composition from alkenylaryloxy triazine'1990 4,908,417'Thermosetting resin composition'1990 4,900,848'Low-viscosity epoxy resin, and fiber-reinforced composite material from triglycidyl m-aminophenols'1990 4,888,407'Imide compound and composition containing the same'1989 4,871,832'Thermosettable imide compound and epoxy resin composition containing the same'1989 4,855,339'Epoxy resin composition'1989 4,808,717'Thermosetting resin composition'1989 4,794,148'Fiber-reinforced composite material'1988 4,755,569'Thermosetting resin composition comprising a partly allylated novolac epoxy resin and bismaleimide'1988 4,705,833'Thermosettable heat-resistant resin compositions'1987 4,632,966'Thermosetting resin composition of an allylated novolak and a bis-maleimide'1986 4,621,123'Phosphinylmethyl polypenols and polyglycidyl ethers thereof'1986 4,529,790'Epoxy resin composition'1985 4,410,457'Conductive paste'1983 4,408,086'Oligomerization of m-isopropenylphenol'1983 4,360,649'Curable composition'1982 4,337,367'Oligomer of m-isopropenylphenol'1982 4,260,831'Oligomerization of m-isopropenylphenol'1981 4,211,715'Epoxy resins and process for producing the same'1980 4,108,924'Stabilized chlorine-containing resin composition'1978

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1978–1995Patents assigned to SUMITOMO CHEMICAL CO (30)· patent assignee history

1978–1983Based in Toyonaka, JP· patent location history

1983Patents assigned to SUMITOMO METAL MINING CO (1)· patent assignee history

1985–1994Based in Suita, JP· patent location history

1987–1989Based in Osaka, JP· patent location history

1992–1994Based in Ibaraki, JP· patent location history

1995Based in Toride, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SUMITOMO CHEMICAL CO	30	1978–1995
SUMITOMO METAL MINING CO	1	1983

Locations

Location	Patents	Span
Suita, JP	17	1985–1994
Toyonaka, JP	7	1978–1983
Toride, JP	2	1995
Ibaraki, JP	2	1992–1994
Osaka, JP	2	1987–1989