Inventor

GUO-HUEI WU

Inventor

TW

Overview

2022–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 45 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Dprimary

H10DInorganic electric semiconductor devices28%

H01LSemiconductor devices26%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%

G06FElectric digital data processing10%

B82YSpecific uses or applications of nanostructures4%

Y02PClimate change mitigation technologies in the production or processing of goods2%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices1%

H03KPulse technique1%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h101%

H10BElectronic memory devices1%

PatentTitleYear

12,588,492Power rail and signal line arrangement in integrated circuits having stacked transistors2026 12,588,491Power rail and signal line arrangement in integrated circuits having stacked transistors2026 12,568,685Integrated circuit2026 12,538,782Semiconductor device including recessed interconnect structure2026 12,520,583Stacking nanosheet transistors with an intermediate gate structure absent2026 12,419,114Integrated circuit2025 12,402,415Integrated circuit with backside power rail and backside interconnect2025 12,381,145Signal conducting line arrangements in integrated circuits2025 12,381,148Buried pad for use with gate-all-around device2025 12,341,103Integrated circuit and method of manufacturing same2025 12,324,245Layout architecture for a cell2025 12,317,589Power rail and signal conducting line arrangement2025 12,300,699Integrated circuit2025 12,237,332Integrated circuit2025 12,224,278Active zones with offset in semiconductor cell2025 12,218,132Integrated circuit2025 12,205,899Method of making semiconductor device including buried conductive fingers2025 12,125,850Buried metal track and methods forming same2024 12,079,559IC device layout method2024 12,080,647Integrated circuit, system and method of forming the same2024 12,074,168Semiconductor device and method of manufacturing the same2024 12,033,935Semiconductor device including recessed interconnect structure2024 12,027,461Semiconductor device including buried conductive fingers and method of making the same2024 12,027,598Buried pad for use with gate-all-around device2024 11,984,441Integrated circuit with backside power rail and backside interconnect2024 11,967,596Power rail and signal conducting line arrangement2024 11,948,886Semiconductor device and methods of manufacturing same2024 11,942,420Semiconductor device including recessed interconnect structure2024 11,916,017Signal conducting line arrangements in integrated circuits2024 11,894,383Staking nanosheet transistors2024 11,855,068Active zones with offset in semiconductor cell2023 11,830,869Integrated circuit2023 11,783,109IC device manufacturing method2023 11,776,958Semiconductor device having buried logic conductor type of complementary field effect transistor, method of forming same2023 11,764,154Power rail and signal line arrangement in integrated circuits having stacked transistors2023 11,710,743Integrated circuit2023 11,664,380Semiconductor device and method of manufacturing the same2023 11,569,168Integrated circuit, system and method of forming the same2023 11,508,659Interconnect structure in semiconductor device and method of forming the same2022 11,508,661Integrated circuit and method of manufacturing same2022 11,444,018Semiconductor device including recessed interconnect structure2022 11,374,003Integrated circuit2022 11,362,090Semiconductor device having buried logic conductor type of complementary field effect transistor, method of generating layout diagram and system for same2022 11,362,110Semiconductor structure and method for manufacturing the same2022 11,296,070Integrated circuit with backside power rail and backside interconnect2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (45)· patent assignee history

2022–2026Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	45	2022–2026

Locations

Location	Patents	Span
TW	45	2022–2026