Inventor
ISAO OSHIMA
Inventor
JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems18%
H02PControl or regulation of electric motors, electric generators or dynamo-electric converters9%
PatentTitleYear
11,990,447Semiconductor device and power conversion device202411,557,531Semiconductor device with metal film, power conversion device with the semiconductor device, and method of manufacturing the semiconductor device202311,211,355Semiconductor device, method for manufacturing semiconductor device, and power conversion device202111,183,479Semiconductor device, method for manufacturing the same, and power conversion device2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to MITSUBISHI ELECTRIC CORP (4)· patent assignee history
2021–2024Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 4 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 4 | 2021–2024 |