Inventor
Wayne P. Richling
Inventor
Fort Collins, CO, US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H01LSemiconductor devices25%
G01BMeasuring length, thickness or similar linear dimensions13%
H10DInorganic electric semiconductor devices13%
PatentTitleYear
9,859,205'Semiconductor device having an airbridge and method of fabricating the same'20188,962,443'Semiconductor device having an airbridge and method of fabricating the same'20157,253,528'Trace design to minimize electromigration damage to solder bumps'20077,208,843'Routing design to minimize electromigration damage to solder bumps'20074,992,840'Carbon doping MOSFET substrate to suppress hit electron trapping'19914,566,193'Use of an electronic vernier for evaluation of alignment in semiconductor processing'1986Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1986–1991Patents assigned to HEWLETT PACKARD CO (2)· patent assignee history
1986–1991Based in Corvallis, OR, US· patent location history
2007–2018Patents assigned to AVAGO TECHNOLOGIES GENERAL IP (4)· patent assignee history
2007–2018Based in Fort Collins, CO, US· patent location history
2015Patents assigned to RICHLING WAYNE P (1)· patent assignee history
2015Patents assigned to WHETTEN TIMOTHY J (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AVAGO TECHNOLOGIES GENERAL IP | 4 | 2007–2018 |
| HEWLETT PACKARD CO | 2 | 1986–1991 |
| RICHLING WAYNE Pself | 1 | 2015 |
| WHETTEN TIMOTHY J | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fort Collins, CO, US | 4 | 2007–2018 |
| Corvallis, OR, US | 2 | 1986–1991 |