Inventor
Takushi Yoshida
Inventor
Tokyo, JP
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Rprimary
H01RElectrically-conductive connections17%
B23KSoldering or unsoldering12%
Y10TTechnical subjects covered by former us classification10%
A23LFoods, foodstuffs or non-alcoholic beverages, not otherwise provided for7%
A61KPreparations for medical, dental or toiletry purposes7%
C08BPolysaccharides7%
H05KPrinted circuits7%
A61QSpecific use of cosmetics or similar toiletry preparations5%
A23VIndexing scheme relating to foods, foodstuffs or non-alcoholic beverages and lactic or propionic acid bacteria used in foodstuffs or food preparation3%
C08LCompositions of macromolecular compounds3%
PatentTitleYear
10,643,915Lead bonding structure202010,312,603Fixing structure and fixing method201910,193,241Fixing structure and fixing method201910,155,824Carboxymethyl-group-containing modified hyaluronic acid and/or salt thereof and/or production method for carboxymethyl-group-containing modified hyaluronic acid and/or salt thereof201810,032,684Lead bonding structure20189,331,433'Connector'20169,252,551'Apparatus for manufacturing a connector'20169,099,830'Method of manufacturing a connector'20158,933,054'Low molecular weight hyaluronic acid and/or salt thereof, method for producing same, and cosmetic preparation and food composition containing same'20158,829,180'Method of purifying a low molecular weight hyaluronic acid or cationized hyaluronic acid via precipitation from aqueous solution by addition of alcohol or acetone followed by ph adjustment'20148,759,679'Wire to conductive metal plate laser welding structure'20148,727,810'Connector'20148,690,613'Connector easily enabling a reduction in thickness and being structurally stable'20148,469,743'Connector, method of manufacturing the connector and apparatus for manufacturing the connector'20138,367,818'Low molecular weight hyaluronic acid and/or salt thereof, and cosmetic preparation, pharmaceutical composition, and food composition each using same'20138,052,834'Substrate treating system, substrate treating device, program, and recording medium'20116,913,488'Electrical connector'20056,807,455'System for and method of processing substrate'20046,754,960'Device for removing coating on optical fiber'20045,871,207'Damper means'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999Based in Tochigi, JP· patent location history
2004–2011Patents assigned to DAINIPPON SCREEN MFG (2)· patent assignee history
2004–2020Based in Tokyo, JP· patent location history
2004–2011Based in Kyoto, JP· patent location history
2005–2016Patents assigned to JAPAN AVIATION ELECTRON (8)· patent assignee history
2013–2015Patents assigned to YOSHIDA TAKUSHI (7)· patent assignee history
2013–2014Patents assigned to AKIMOTO HIROSHI (4)· patent assignee history
2014–2015Based in Kunitachi, JP· patent location history
2018–2020Patents assigned to JAPAN AVIATION ELECTRONICS IND LTD (4)· patent assignee history
2018Based in Chofu, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| JAPAN AVIATION ELECTRON | 8 | 2005–2016 |
| YOSHIDA TAKUSHIself | 7 | 2013–2015 |
| AKIMOTO HIROSHI | 4 | 2013–2014 |
| JAPAN AVIATION ELECTRONICS IND LTD | 4 | 2018–2020 |
| DAINIPPON SCREEN MFG | 2 | 2004–2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 14 | 2004–2020 |
| Kunitachi, JP | 2 | 2014–2015 |
| Kyoto, JP | 2 | 2004–2011 |
| Chofu, JP | 1 | 2018 |
| Tochigi, JP | 1 | 1999 |