Inventor
Niranjan Sunil Mudakatte
Inventor
San Diego, CA, US
Overview
Patents· 35 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H10DInorganic electric semiconductor devices15%
H03HImpedance networks, e.g. resonant circuits14%
H01FMagnets10%
H05KPrinted circuits8%
H04BTransmission5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
H01GCapacitors2%
H03FAmplifiers1%
PatentTitleYear
11,024,454High performance inductors202110,944,379Hybrid passive-on-glass (POG) acoustic filter202110,693,432Solenoid structure with conductive pillar technology202010,614,942Inductors formed with through glass vias202010,607,980Passive-on-glass (POG) device and method202010,582,609Integration of through glass via (TGV) filter and acoustic filter202010,523,253Glass substrate including passive-on-glass device and semiconductor die201910,498,307Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductor201910,490,348Two-dimensional structure to form an embedded three-dimensional structure201910,490,621Close proximity tunable inductive elements201910,332,671Solenoid inductor201910,290,414Substrate comprising an embedded inductor and a thin film magnetic core201910,292,269Inductor with metal-insulator-metal (MIM) capacitor201910,187,031Tunable matching network201910,171,112RF multiplexer with integrated directional couplers201910,163,771Interposer device including at least one transistor and at least one through-substrate via201810,141,908Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance201810,103,135Backside ground plane for integrated circuit201810,103,703Double-sided circuit201810,103,116Open-passivation ball grid array pads201810,074,625Wafer level package (WLP) ball support using cavity structure201810,069,474Encapsulation of acoustic resonator devices201810,044,390Glass substrate including passive-on-glass device and semiconductor die201810,038,422Single-chip multi-frequency film bulk acoustic-wave resonators201810,026,546Apparatus with 3D wirewound inductor integrated within a substrate20189,966,426Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications20189,959,964Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications20189,893,048'Passive-on-glass (POG) device and method'20189,875,848MIM capacitor and method of making the same20189,876,513LC filter layer stacking by layer transfer to make 3D multiplexer structures20189,807,882'Density-optimized module-level inductor ground structure'20179,780,048'Side-assembled passive devices'20179,673,275'Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuits'20179,343,403'Stress mitigation structure for wafer warpage reduction'20169,343,399'Thick conductive stack plating process with fine critical dimension feature size for compact passive on glass technology'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2021Patents assigned to QUALCOMM INC (35)· patent assignee history
2016–2021Based in San Diego, CA, US· patent location history
2018Patents assigned to QUALCOMM INCORPORTED (1)· patent assignee history
2019Based in San Jose, CA, US· patent location history
2020Patents assigned to QUALCOMMM INCORPORATED (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| QUALCOMM INC | 35 | 2016–2021 |
| QUALCOMM INCORPORTED | 1 | 2018 |
| QUALCOMMM INCORPORATED | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Diego, California, US | 34 | 2016–2021 |
| San Jose, California, US | 1 | 2019 |