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Inventor

CHRISTOPHER PELTO

Inventor
US

Overview

3→
Patents
2025
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
PatentTitleYear
12,469,801Moisture seal coating of hybrid bonded stacked die package assembly202512,436,467Simulating die rotation to minimize area overhead of reticle stitching for stacked dies202512,431,441Interlayer dielectric stack optimization for wafer bow reduction2025

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2025Patents assigned to INTEL CORP (3)· patent assignee history
2025Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INTEL CORP32025
Locations
LocationPatentsSpan
US32025