Inventor

Yuki Yasuda

Inventor

Sakai, JP

Overview

18→

Patents

2006–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 18 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices19%

H10KOrganic electric solid-state devices15%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution13%

Y02PClimate change mitigation technologies in the production or processing of goods13%

H05BElectric heating9%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%

G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein4%

G09FDisplaying4%

A61FFilters implantable into blood vessels3%

F24J3%

PatentTitleYear

10,916,490Semiconductor device2021 10,862,075Manufacturing method for EL device2020 10,784,319Flexible display panel, flexible display device, and method for producing flexible display panel2020 10,707,156Electronic device2020 10,693,070Manufacturing method for electroluminescence device2020 10,636,996Display device, production method of display device, production device of display device, and film formation device2020 10,509,284Liquid crystal display device2019 10,242,937Electronic device and method for manufacturing electronic device2019 10,236,459Display device and method for producing same2019 10,177,347Method for manufacturing display device2019 9,945,584Heating tool2018 9,920,954'Heating tool'2018 9,887,384'Method for producing flexible display device, and flexible display device'2018 9,735,393'Organic electroluminescent display device'2017 9,530,984'Organic electroluminescence display and method of manufacturing the same'2016 9,478,766'Manufacturing method for organic EL display device, and organic EL display device manufactured by such method'2016 7,781,259'Method of manufacturing a semiconductor using a rigid substrate'2010 7,122,402'Method of manufacturing a semiconductor device using a rigid substrate including the vent-end edge portion of the substrate has a thickness smaller than the other portions of the substrate'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2010Based in Aizuwakamatsu, JP· patent location history

2016–2020Patents assigned to SHARP KK (11)· patent assignee history

2016–2018Based in Osaka, JP· patent location history

2018Patents assigned to KOBAYASHI PHARMACEUTICAL CO LTD (2)· patent assignee history

2019–2020Patents assigned to KATOH ELECTRIC CO LTD (2)· patent assignee history

2019–2020Patents assigned to TOREX SEMICONDUCTOR LTD (2)· patent assignee history

2019–2020Based in Sakai, JP· patent location history

2019–2020Based in Yamanashi, JP· patent location history

2021Patents assigned to FUJI ELECTRIC CO LTD (1)· patent assignee history

2021Based in Matsumoto, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SHARP KK	11	2016–2020
KATOH ELECTRIC CO LTD	2	2019–2020
KOBAYASHI PHARMACEUTICAL CO LTD	2	2018
TOREX SEMICONDUCTOR LTD	2	2019–2020
FUJI ELECTRIC CO LTD	1	2021

Locations

Location	Patents	Span
Sakai, JP	7	2019–2020
Osaka, JP	6	2016–2018
Yamanashi, JP	2	2019–2020
Aizuwakamatsu, JP	2	2006–2010
Matsumoto, JP	1	2021