Inventor
Chang Bum Chung
Inventor
Yongin-si, KR
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Lprimary
C08LCompositions of macromolecular compounds17%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients13%
H05KPrinted circuits13%
C08JWorking-up9%
H01BCables9%
A61KPreparations for medical, dental or toiletry purposes4%
A61LMethods or apparatus for sterilising materials or objects in general4%
C09DCoating compositions, e.g. paints, varnishes or lacquers4%
C09JAdhesives4%
C12NMicroorganisms or enzymes4%
PatentTitleYear
11,090,387Hydrolytically degradable polysaccharide hydrogels202110,905,038Electromagnetic interference ("EMI") sheet attenuators20218,419,978'Anisotropic conductive film composition'20137,879,259'Anisotropic conductive film composition'20117,863,758'Adhesive film composition, associated dicing die bonding film, and die package'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2013Patents assigned to CHEIL IND INC (3)· patent assignee history
2011–2013Based in Yongin-si, KR· patent location history
2013Patents assigned to CHOI JUNG SIK (1)· patent assignee history
2013Patents assigned to CHUNG CHANG BUM (1)· patent assignee history
2021Patents assigned to BURDICK JASON ALAN (1)· patent assignee history
2021Patents assigned to CHUNG CINDY (1)· patent assignee history
2021Based in Palo Alto, CA, US· patent location history
2021Based in Milpitas, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CHEIL IND INC | 3 | 2011–2013 |
| BURDICK JASON ALAN | 1 | 2021 |
| CHOI JUNG SIK | 1 | 2013 |
| CHUNG CHANG BUMself | 1 | 2013 |
| CHUNG CINDYself | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yongin-si, KR | 3 | 2011–2013 |
| Palo Alto, California, US | 1 | 2021 |
| Milpitas, California, US | 1 | 2021 |