Inventor
Wataru Hirai
Inventor
Osaka, JP
Overview
24→
Patents
1989–2018
Patent span
General tagging of new technological developments
Primary field (CPC Y)
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits32%
Y10TTechnical subjects covered by former us classification29%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%
G01SRadio direction-finding5%
B05CApparatus for applying fluent materials to surfaces, in general3%
B41FPrinting machines or presses3%
E05FDevices for moving wings into open or closed position3%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light3%
G01VGeophysics3%
B23PMetal-working not otherwise provided for2%
PatentTitleYear
9,909,350'Vehicular reflective optical sensor'20189,841,504'Photosensor unit with a condensing lens including a plurality of light-emitting convex lens'20179,733,122'Photosensor lens including a purality of convex lens surfaces'20177,464,838'Viscous material application apparatus'20087,185,422'Part mounting apparatus and part mounting method'20077,131,478'Component supply system'20066,910,514'Part feeder'20056,839,959'Component mounting apparatus'20056,736,291'Viscous material application apparatus'20046,336,268'Electronic part mounting machine'20026,293,003'Electronic part mounting device'20016,178,621'Electronic component mounting apparatus'20016,026,885'Electronic component feeder'20005,933,942'Component mounting apparatus'19995,850,689'Method and apparatus for supporting printed board'19985,743,005'Component mounting apparatus and method'19985,740,604'Component-mounting apparatus and method'19985,727,311'Method and apparatus for mounting component'19985,457,874'Mounting apparatus of electronic component'19955,379,514'Electronic component installing apparatus and method'19955,339,248'Apparatus for mounting electronic component on substrate'19945,249,356'Method and apparatus for mounting electronic component'19934,999,909'Electric component mounting apparatus'19914,831,721'Mounting head exchange arrangement for part mounting machine'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989–2007Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (20)· patent assignee history
1989–1995Based in Hirakata, JP· patent location history
1993–2008Based in Osaka, JP· patent location history
2005–2006Based in Yamanashi, JP· patent location history
2007Based in Nakakoma-gun, JP· patent location history
2008Patents assigned to PANASONIC CORP (1)· patent assignee history
2017–2018Patents assigned to ALPHA CORP (3)· patent assignee history
2017–2018Patents assigned to NISSAN MOTOR (3)· patent assignee history
2017–2018Based in Atsugi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 20 | 1989–2007 |
| ALPHA CORP | 3 | 2017–2018 |
| NISSAN MOTOR | 3 | 2017–2018 |
| PANASONIC CORP | 1 | 2008 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 13 | 1993–2008 |
| Hirakata, JP | 5 | 1989–1995 |
| Atsugi, JP | 3 | 2017–2018 |
| Yamanashi, JP | 2 | 2005–2006 |
| Nakakoma-gun, JP | 1 | 2007 |