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Inventor

Tomoyuki Fujinami

Inventor
Fujisawa, JP

Overview

3→
Patents
2001–2014
Patent span
Chemistry
Primary field (CPC C)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C23Cprimary
C23CCoating metallic material43%
Y10TTechnical subjects covered by former us classification29%
B05DProcesses for applying fluent materials to surfaces, in general14%
H05KPrinted circuits14%
PatentTitleYear
8,771,409'Electroless gold plating solution and electroless gold plating method'20146,329,072'Microporous copper film and electroless copper plating solution for obtaining the same'20016,193,789'Electroless copper plating solution and method for electroless copper plating'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001Patents assigned to EBARA UDYLITE KK (2)· patent assignee history
2001Patents assigned to HONMA HIDEO (1)· patent assignee history
2001Based in Fujisawa, JP· patent location history
2014Patents assigned to ASAKAWA TAKANOBU (1)· patent assignee history
2014Patents assigned to ELECTROPLATING ENG (1)· patent assignee history
2014Patents assigned to FUJINAMI TOMOYUKI (1)· patent assignee history
2014Based in Hiratsuka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
EBARA UDYLITE KK22001
ASAKAWA TAKANOBU12014
ELECTROPLATING ENG12014
FUJINAMI TOMOYUKIself12014
HONMA HIDEO12001
Locations
LocationPatentsSpan
Fujisawa, JP22001
Hiratsuka, JP12014