Inventor
Thomas J. Fitzgerald
Inventor
Phoenix, AZ, US
Overview
Patents· 33 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
Y10TTechnical subjects covered by former us classification15%
H01LSemiconductor devices7%
B23KSoldering or unsoldering6%
G06FElectric digital data processing4%
A63GMerry-go-rounds3%
B22DCasting of metals3%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
A01DHarvesting1%
PatentTitleYear
10,763,188Integrated heat spreader having electromagnetically-formed features202010,236,233Heat spreaders with integrated preforms20199,799,584'Heat spreaders with integrated preforms'20179,515,003'Embedded air core inductors for integrated circuit package substrates with thermal conductor'20169,330,999'Multi-component integrated heat spreader for multi-chip packages'20168,490,550'Roller coaster with articulable seat backs'20138,179,337'Mobile projected sets'20127,996,989'Heat dissipating device with preselected designed interface for thermal interface materials'20117,882,683'Systems and methods of processing and transporting waste'20117,672,132'Electronic packaging apparatus and method'20107,553,702'Integrating a heat spreader with an interface material having reduced void size'20097,527,090'Heat dissipating device with preselected designed interface for thermal interface materials'20097,364,063'Thermally coupling an integrated heat spreader to a heat sink base'20087,362,580'Electronic assembly having an indium wetting layer on a thermally conductive body'20087,256,058'Device and method for package warp compensation in an integrated heat spreader'20077,239,517'Integrated heat spreader and method for using'20077,219,421'Method of a coating heat spreader'20077,160,758'Electronic packaging apparatus and method'20077,102,226'Device and method for package warp compensation in an integrated heat spreader'20067,081,669'Device and system for heat spreader with controlled thermal expansion'20066,848,172'Device and method for package warp compensation in an integrated heat spreader'20056,817,091'Electronic assembly having solder thermal interface between a die substrate and a heat spreader'20046,751,099'Coated heat spreaders'20046,504,723'Electronic assembly having solder thermal interface between a die substrate and a heat spreader'20036,504,242'Electronic assembly having a wetting layer on a thermally conductive heat spreader'20035,836,075'Process for forming combustion turbine components by transient liquid phase bonding'19985,632,716'Apparatus and method of muscle training in dynamic cardiomyoplasty'19975,571,848'Method for producing a microcellular foam'19965,369,778'Data processor that customizes program behavior by using a resource retrieval capability'19945,354,488'Fluid responsive to a magnetic field'19944,777,619'Method of assuring a proper computer subsystem configuration'19884,678,403'Liquid level sensor for controlling pump operation'19874,463,502'Magnetic distributor-downcomer for fluidized beds and magnetic valve to control the flow of solids'1984Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1984–2012Patents assigned to FITZGERALD THOMAS J (3)· patent assignee history
1998Based in Longwood, FL, US· patent location history
2003–2020Patents assigned to INTEL CORP (22)· patent assignee history
2003–2020Based in Phoenix, AZ, US· patent location history
2005–2007Based in Phoeniz, AZ, US· patent location history
2011Based in Lake Forest, IL, US· patent location history
2012–2013Patents assigned to CRAWFORD DAVID W (2)· patent assignee history
2012–2013Patents assigned to DURHAM DAVID A (2)· patent assignee history
2012Patents assigned to DISNEY ENTPR (1)· patent assignee history
2012–2013Based in Altadena, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 22 | 2003–2020 |
| FITZGERALD THOMAS Jself | 3 | 1984–2012 |
| CRAWFORD DAVID W | 2 | 2012–2013 |
| DURHAM DAVID A | 2 | 2012–2013 |
| DISNEY ENTPR | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Phoenix, AZ, US | 20 | 2003–2020 |
| Altadena, California, US | 2 | 2012–2013 |
| Phoeniz, AZ, US | 2 | 2005–2007 |
| Lake Forest, Illinois, US | 1 | 2011 |
| Longwood, Florida, US | 1 | 1998 |