Inventor

Ichiro Anjoh

Inventor

Koganei, JP

Overview

1993–2013

Patent span

Electricity

Primary field (CPC H)

Patents· 69 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1049%

Y10TTechnical subjects covered by former us classification19%

H05KPrinted circuits11%

H10DInorganic electric semiconductor devices7%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%

G11CStatic stores2%

H10BElectronic memory devices2%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h102%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form1%

B29CShaping or joining of plastics1%

PatentTitleYear

8,441,126'Semiconductor device'2013 7,969,019'Module with stacked semiconductor devices'2011 7,964,962'Method of manufacturing a semiconductor apparatus'2011 7,786,564'Semiconductor device and method for manufacturing semiconductor device'2010 7,420,284'Semiconductor device and manufacturing method thereof'2008 7,217,992'Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device'2007 7,202,570'Circuit tape having adhesive film semiconductor device and a method for manufacturing the same'2007 7,091,620'Semiconductor device and manufacturing method thereof'2006 7,038,325'Wiring tape for semiconductor device including a buffer layer having interconnected foams'2006 6,888,230'Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device'2005 6,861,294'Semiconductor devices and methods of making the devices'2005 6,844,219'Semiconductor device and lead frame therefor'2005 6,791,194'Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same'2004 6,710,610'Socket for testing of semiconductor device, and semiconductor device and method of manufacturing the semiconductor device'2004 6,710,446'Semiconductor device comprising stress relaxation layers and method for manufacturing the same'2004 6,686,226'Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame'2004 6,670,215'Semiconductor device and manufacturing method thereof'2003 6,664,135'Method of manufacturing a ball grid array type semiconductor package'2003 6,642,083'Semiconductor device and manufacturing method thereof'2003 6,521,981'Semiconductor device and manufacturing method thereof'2003 6,472,727'Semiconductor device and manufacturing method thereof'2002 6,465,876'Semiconductor device and lead frame therefor'2002 6,433,440'Semiconductor device having a porous buffer layer for semiconductor device'2002 6,396,145'Semiconductor device and method for manufacturing the same technical field'2002 6,365,439'Method of manufacturing a ball grid array type semiconductor package'2002 6,355,975'Semiconductor device and manufacturing method thereof'2002 6,355,500'Semiconductor device and manufacturing method thereof'2002 6,353,255'Semiconductor device and manufacturing method thereof'2002 RE037539'Sealed stacked arrangement of semiconductor devices'2002 6,342,728'Semiconductor device and manufacturing method thereof'2002 6,342,726'Semiconductor device and manufacturing method thereof'2002 6,297,073'Semiconductor device'2001 6,130,114'Semiconductor device'2000 6,130,112'Semiconductor device'2000 6,114,005'Laminate and multilayer printed circuit board'2000 6,114,753'Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same'2000 6,114,192'Method of manufacturing a semiconductor device having a ball grid array package structure using a supporting frame'2000 6,081,023'Semiconductor device'2000 6,072,231'Semiconductor device'2000 6,049,128'Semiconductor device'2000 6,030,859'Method of making a packaged semiconductor device and a lead-frame therefor'2000 6,018,191'Semiconductor device'2000 5,981,315'Semiconductor device'1999 5,914,531'Semiconductor device having a ball grid array package structure using a supporting frame'1999 5,914,530'Semiconductor device'1999 5,895,965'Semiconductor device'1999 5,869,888'Semiconductor device with lead structure on principal surface of chip'1999 5,793,099'Semiconductor device'1998 5,714,405'Semiconductor device'1998 5,701,031'Sealed stacked arrangement of semiconductor devices'1997 5,677,045'Laminate and multilayer printed circuit board'1997 5,648,299'Packaged semiconductor device and a leadframe therefor'1997 5,612,569'Semiconductor device'1997 5,585,665'Packaged semiconductor device and a leadframe therefor'1996 5,583,375'Semiconductor device with lead structure within the planar area of the device'1996 5,571,428'Semiconductor leadframe and its production method and plastic encapsulated semiconductor device'1996 5,569,960'Electronic component, electronic component assembly and electronic component unit'1996 5,530,286'Semiconductor device'1996 5,466,888'Packaged semiconductor device having stress absorbing film'1995 5,442,233'Packaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipation'1995 5,437,915'Semiconductor leadframe and its production method and plastic encapsulated semiconductor device'1995 5,406,028'Packaged semiconductor device having stress absorbing film'1995 5,371,044'Method of uniformly encapsulating a semiconductor device in resin'1994 5,358,904'Semiconductor device'1994 5,357,139'Plastic encapsulated semiconductor device and lead frame'1994 5,332,922'Multi-chip semiconductor package'1994 5,299,092'Plastic sealed type semiconductor apparatus'1994 5,296,737'Semiconductor device with a plurality of face to face chips'1994 5,256,903'Plastic encapsulated semiconductor device'1993

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1993–2004Patents assigned to HITACHI LTD (53)· patent assignee history

1993–2008Based in Koganei, JP· patent location history

1995–2000Patents assigned to TEXAS INSTRUMENTS INC (6)· patent assignee history

2000–2007Patents assigned to HITACHI CABLE (4)· patent assignee history

2003–2008Patents assigned to RENESAS TECH CORP (11)· patent assignee history

2010–2013Patents assigned to ELPIDA MEMORY INC (3)· patent assignee history

2010–2013Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI LTD	53	1993–2004
RENESAS TECH CORP	11	2003–2008
TEXAS INSTRUMENTS INC	6	1995–2000
HITACHI CABLE	4	2000–2007
ELPIDA MEMORY INC	3	2010–2013

Locations

Location	Patents	Span
Koganei, JP	65	1993–2008
Tokyo, JP	4	2010–2013