Inventor
Michael Huettinger
Inventor
Munich, DE
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices42%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
PatentTitleYear
10,978,418Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer202110,672,678Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package202010,497,634Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound201910,461,056Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact20199,941,181Chip package and method of forming a chip package2018Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2018–2021Patents assigned to INFINEON TECHNOLOGIES AG (5)· patent assignee history
2018–2021Based in Munich, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 5 | 2018–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Munich, DE | 5 | 2018–2021 |