Inventor
GEORGIOS C. DOGIAMIS
Inventor
US
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H01QAntennas, i.e. radio aerials10%
H01PWaveguides9%
H03HImpedance networks, e.g. resonant circuits4%
H04LTransmission of digital information, e.g. telegraphic communication4%
H10DInorganic electric semiconductor devices4%
H01FMagnets2%
H04BTransmission2%
H05KPrinted circuits2%
PatentTitleYear
12,598,997Inductor with integrated magnetics202612,598,996Passive circuit on a back-end-of-line of a package202612,573,744Wideband antennas in glass through direct via feeding and glass stacking202612,542,358Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems202612,525,496Glass vias and planes with reduced tapering202612,489,189Contactless communication using a waveguide extending through a substrate core202512,444,619Physical vapor deposition seeding for high aspect ratio vias in glass core technology202512,424,719Compact surface transmission line waveguides with vertical ground planes202512,424,716RF filters and multiplexers manufactured in the core of a package substrate using glass core technology202512,368,091Package substrate with glass core having vertical power planes for improved power delivery202512,347,761Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate202512,183,961Methods for conductively coating millimeter waveguides202412,155,133Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems202411,658,418Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems202311,575,749Low-weight single mm-wave dielectric waveguide interconnect architecture in autonomous cars202311,456,721RF front end module including hybrid filter and active circuits in a single package202211,437,693Mmwave waveguides featuring power-over-waveguide technology for automotive applications202211,430,751Microelectronic devices designed with 3D stacked ultra thin package modules for high frequency communications202211,387,200Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric202211,380,624Electromagnetic interference shield created on package using high throughput additive manufacturing202211,367,708Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric202211,335,651Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric202211,282,800Substrate integrated inductors using high throughput additive deposition of hybrid magnetic materials202211,283,427Hybrid filters and packages therefor202211,223,524Package integrated security features202211,221,354Switched closed loop read-out methods and systems for resonant sensing platforms202211,206,008Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to INTEL CORP (27)· patent assignee history
2021–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 27 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 27 | 2021–2026 |