Inventor
Hsi-Chang Hsu
Inventor
Taichung, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H01LSemiconductor devices42%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
PatentTitleYear
9,607,974'Package structure and fabrication method thereof'20179,397,081'Fabrication method of semiconductor package having embedded semiconductor elements'20169,177,859'Semiconductor package having embedded semiconductor elements'20159,040,361'Chip scale package with electronic component received in encapsulant, and fabrication method thereof'20158,828,796'Semiconductor package and method of manufacturing the same'20148,766,456'Method of fabricating a semiconductor package'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2017Patents assigned to SILICONWARE PRECISION INDUSTRIES CO LTD (6)· patent assignee history
2014–2017Based in Taichung, TW· patent location history
2015Patents assigned to CHANG CHIANG-CHENG (1)· patent assignee history
2015Patents assigned to HSU HSI-CHANG (1)· patent assignee history
2015Patents assigned to HUANG CHIEN-PING (1)· patent assignee history
2015Patents assigned to KE CHUN-CHI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SILICONWARE PRECISION INDUSTRIES CO LTD | 6 | 2014–2017 |
| CHANG CHIANG-CHENG | 1 | 2015 |
| HSU HSI-CHANGself | 1 | 2015 |
| HUANG CHIEN-PING | 1 | 2015 |
| KE CHUN-CHI | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taichung, TW | 6 | 2014–2017 |