Inventor
LI-HUAN CHU
Inventor
TW
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
H05KPrinted circuits14%
B65BMachines, apparatus or devices for, or methods of, packaging articles or materials4%
B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers4%
H10DInorganic electric semiconductor devices4%
H10BElectronic memory devices2%
PatentTitleYear
12,525,582Semiconductor package assembly and electronic device202612,237,226Dicing method for stacked semiconductor devices202512,205,859Package and printed circuit board attachment202512,159,847Integrated fan-out structures and methods for forming the same202412,051,624Stacked semiconductor devices and methods of forming thereof202412,016,126Carrier tape system and components and methods of use202411,990,423Magnetic shielding material with insulator-coated ferromagnetic particles202411,742,276Semiconductor package and manufacturing process thereof202311,610,827Package and printed circuit board attachment202311,527,499Integrated fan-out structures and methods for forming the same202211,404,383Magnetic shielding material with insulator-coated ferromagnetic particles202211,342,291Semiconductor packages with crack preventing structure202211,315,860Semiconductor package and manufacturing process thereof202211,239,143Semiconductor structure and manufacturing method thereof202211,240,947Carrier tape system and components and methods of use2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (14)· patent assignee history
2022–2026Based in TW· patent location history
2026Patents assigned to MEDIATEK INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 14 | 2022–2025 |
| MEDIATEK INC | 1 | 2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 15 | 2022–2026 |