Inventor
Jaroslaw W. Winniczek
Inventor
Daly City, CA, US
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Jprimary
H01JElectric discharge tubes or discharge lamps28%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1028%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
H01LSemiconductor devices7%
G01NInvestigating or analysing materials by determining their chemical or physical properties5%
C03CChemical composition of glasses, glazes or vitreous enamels3%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
G06TImage data processing or generation, in general3%
H04NPictorial communication, e.g. television3%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
11,116,442Image integrity and repeatability system202111,050,984Image quality detection and correction system20219,865,472'Fabrication of a silicon structure and deep silicon etch with profile control'20189,330,926'Fabrication of a silicon structure and deep silicon etch with profile control'20169,018,098'Silicon etch with passivation using chemical vapor deposition'20158,871,105'Method for achieving smooth side walls after Bosch etch process'20148,757,178'Method and apparatus for removing photoresist'20148,609,548'Method for providing high etch rate'20138,598,037'Silicon etch with passivation using plasma enhanced oxidation'20138,425,682'High strip rate downstream chamber'20138,298,336'High strip rate downstream chamber'20128,173,547'Silicon etch with passivation using plasma enhanced oxidation'20128,043,434'Method and apparatus for removing photoresist'20117,605,063'Photoresist stripping chamber and methods of etching photoresist on substrates'20097,542,134'System, method and apparatus for in-situ substrate inspection'20097,397,555'System, method and apparatus for in-situ substrate inspection'20086,969,619'Full spectrum endpoint detection'20056,562,187'Methods and apparatus for determining an etch endpoint in a plasma processing system'20036,489,245'Methods for reducing mask erosion during plasma etching'20026,255,221'Methods for running a high density plasma etcher to achieve reduced transistor device damage'20016,228,278'Methods and apparatus for determining an etch endpoint in a plasma processing system'20016,093,332'Methods for reducing mask erosion during plasma etching'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2018Patents assigned to LAM RES CORP (19)· patent assignee history
2000–2021Based in Daly City, CA, US· patent location history
2012–2016Patents assigned to WINNICZEK JAROSLAW W (8)· patent assignee history
2012–2015Patents assigned to CHEBI ROBERT P (5)· patent assignee history
2013–2016Patents assigned to RUSU CAMELIA (3)· patent assignee history
2021Patents assigned to CAPTUREPROOF INC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAM RES CORP | 19 | 2000–2018 |
| WINNICZEK JAROSLAW Wself | 8 | 2012–2016 |
| CHEBI ROBERT P | 5 | 2012–2015 |
| RUSU CAMELIA | 3 | 2013–2016 |
| CAPTUREPROOF INC | 2 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Daly City, California, US | 22 | 2000–2021 |