Inventor
Daniel Kwo-Hung Shen
Inventor
Junghe, TW
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C09Gprimary
C09GPolishing compositions25%
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
C09KMaterials for miscellaneous applications, not provided for elsewhere19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
PatentTitleYear
10,407,594Chemical mechanical polishing (CMP) composition comprising a polymeric polyamine201910,214,663Chemical-mechanical polishing composition comprising organic/inorganic composite particles20199,496,146'Method for forming through-base wafer vias'20169,255,214'Chemical mechanical polishing (CMP) composition comprising inorganic particles and polymer particles'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2019Patents assigned to BASF SE (4)· patent assignee history
2016–2019Patents assigned to LI YUZHUO (3)· patent assignee history
2016–2019Patents assigned to LAUTER MICHAEL (2)· patent assignee history
2016Patents assigned to SHEN DANIEL KWO-HUNG (2)· patent assignee history
2016–2019Based in Junghe, TW· patent location history
2019Patents assigned to BAO ZHENYU (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| BASF SE | 4 | 2016–2019 |
| LI YUZHUO | 3 | 2016–2019 |
| LAUTER MICHAEL | 2 | 2016–2019 |
| SHEN DANIEL KWO-HUNGself | 2 | 2016 |
| BAO ZHENYU | 1 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Junghe, TW | 4 | 2016–2019 |