Inventor
Anthony J. Toprac
Inventor
Austin, TX, US
Overview
Patents· 77 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1032%
G05BControl or regulating systems in general18%
Y02PClimate change mitigation technologies in the production or processing of goods14%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices9%
H10DInorganic electric semiconductor devices6%
H01JElectric discharge tubes or discharge lamps4%
A61KPreparations for medical, dental or toiletry purposes3%
B24BMachines, devices, or processes for grinding or polishing3%
C07KPeptides3%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
PatentTitleYear
7,200,459'Method for determining optimal photolithography overlay targets based on process performance and yield in microelectronic fabrication'2007RE039518'Run to run control process for controlling critical dimensions'20077,181,354'Method and apparatus for data stackification for run-to-run control'20077,103,439'Method and apparatus for initializing tool controllers based on tool event data'20066,988,017'Adaptive sampling method for improved control in semiconductor manufacturing'20066,970,757'Method and apparatus for updating control state variables of a process control model based on rework data'20056,937,914'Method and apparatus for controlling process target values based on manufacturing metrics'20056,901,340'Method and apparatus for distinguishing between sources of process variation'20056,884,147'Method for chemical-mechanical polish control in semiconductor manufacturing'20056,802,045'Method and apparatus for incorporating control simulation environment'20046,801,817'Method and apparatus for integrating multiple process controllers'20046,789,052'Method of using control models for data compression'20046,785,586'Method and apparatus for adaptively scheduling tool maintenance'20046,784,001'Automated variation of stepper exposure dose based upon across wafer variations in device characteristics, and system for accomplishing same'20046,746,958'Method of controlling the duration of an endpoint polishing process in a multistage polishing process'20046,741,903'Method for relating photolithography overlay target damage and chemical mechanical planarization (CMP) fault detection to CMP tool indentification'20046,725,121'Method and apparatus for using a dynamic control model to compensate for a process interrupt'20046,706,541'Method and apparatus for controlling wafer uniformity using spatially resolved sensors'20046,699,727'Method for prioritizing production lots based on grade estimates and output requirements'20046,675,058'Method and apparatus for controlling the flow of wafers through a process flow'20046,675,137'Method of data compression using principal components analysis'20046,643,557'Method and apparatus for using scatterometry to perform feedback and feed-forward control'20036,632,692'Automated method of controlling critical dimensions of features by controlling stepper exposure dose, and system for accomplishing same'20036,622,059'Automated process monitoring and analysis system for semiconductor processing'20036,622,061'Method and apparatus for run-to-run controlling of overlay registration'20036,615,098'Method and apparatus for controlling a tool using a baseline control script'20036,607,926'Method and apparatus for performing run-to-run control in a batch manufacturing environment'20036,595,830'Method of controlling chemical mechanical polishing operations to control erosion of insulating materials'20036,582,618'Method of determining etch endpoint using principal components analysis of optical emission spectra'20036,564,114'Determining endpoint in etching processes using real-time principal components analysis of optical emission spectra'20036,560,503'Method and apparatus for monitoring controller performance using statistical process control'20036,560,506'Method and apparatus for control for semiconductor processing for reducing effects of environmental effects'20036,551,751'Method and apparatus for controlling a stepper'20036,549,822'Method and apparatus for control of multi-cup semiconductor manufacturing tracks'20036,540,591'Method and apparatus for post-polish thickness and uniformity control'20036,535,774'Incorporation of critical dimension measurements as disturbances to lithography overlay run to run controller'20036,532,428'Method and apparatus for automatic calibration of critical dimension metrology tool'20036,529,789'Method and apparatus for automatic routing for reentrant processes'20036,528,331'Method for identifying and controlling impact of ambient conditions on photolithography processes'20036,511,898'Method for controlling deposition parameters based on polysilicon grain size feedback'20036,470,230'Supervisory method for determining optimal process targets based on product performance in microelectronic fabrication'20026,460,002'Method and apparatus for data stackification for run-to-run control'20026,440,622'Method for controlling and monitoring light source intensity'20026,442,496'Method and apparatus for dynamic sampling of a production line'20026,427,093'Method and apparatus for optimal wafer-by-wafer processing'20026,419,846'Determining endpoint in etching processes using principal components analysis of optical emission spectra'20026,417,912'Method and apparatus for controlling optical-parameters in a stepper'20026,410,351'Method and apparatus for modeling thickness profiles and controlling subsequent etch process'20026,409,879'System for controlling transistor spacer width'20026,405,096'Method and apparatus for run-to-run controlling of overlay registration'20026,405,144'Method and apparatus for programmed latency for improving wafer-to-wafer uniformity'20026,387,823'Method and apparatus for controlling deposition process using residual gas analysis'20026,379,980'Method and apparatus for monitoring material removal tool performance using endpoint time removal rate determination'20026,368,883'Method for identifying and controlling impact of ambient conditions on photolithography processes'20026,368,879'Process control with control signal derived from metrology of a repetitive critical dimension feature of a test structure on the work piece'20026,365,422'Automated variation of stepper exposure dose based upon across wafer variations in device characteristics, and system for accomplishing same'20026,360,133'Method and apparatus for automatic routing for reentrant process'20026,355,388'Method for controlling photoresist strip processes'20026,352,867'Method of controlling feature dimensions based upon etch chemistry concentrations'20026,348,289'System and method for controlling polysilicon feature critical dimension during processing'20026,346,426'Method and apparatus for characterizing semiconductor device performance variations based on independent critical dimension measurements'20026,316,302'Isotropically etching sidewall spacers to be used for both an NMOS source/drain implant and a PMOS LDD implant'20016,304,999'Method and apparatus for embedded process control framework in tool systems'20016,268,227'Method for controlling photoresist removal processes'20016,245,581'Method and apparatus for control of critical dimension using feedback etch control'20016,239,467'Method of forming semiconductor devices using gate electrode length and spacer width for controlling drive current strength'20016,238,937'Determining endpoint in etching processes using principal components analysis of optical emission spectra with thresholding'20016,230,069'System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control'20016,228,663'Method of forming semiconductor devices using gate insulator thickness and channel length for controlling drive current strength'20016,136,616'Method of forming semiconductor devices using gate electrode dimensions and dopant concentration for controlling drive current strength'20006,133,132'Method for controlling transistor spacer width'20006,130,414'Systems and methods for controlling semiconductor processing tools using measured current flow to the tool'20006,124,610'Isotropically etching sidewall spacers to be used for both an NMOS source/drain implant and a PMOS LDD implant'20006,110,785'Formulation of high performance transistors using gate trim etch process'20005,926,690'Run-to-run control process for controlling critical dimensions'19995,863,824'Method of forming semiconductor devices using gate electrode length and spacer width for controlling drivecurrent strength'19995,783,497'Forced-flow wafer polisher'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998Patents assigned to SEMATECH INC (1)· patent assignee history
1998–2007Based in Austin, TX, US· patent location history
1999–2007Patents assigned to ADVANCED MICRO DEVICES INC (73)· patent assignee history
2004Patents assigned to ADAVANCED MICRO DEVICES INC (1)· patent assignee history
2005Patents assigned to YIELD DYNAMICS INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED MICRO DEVICES INC | 73 | 1999–2007 |
| ADAVANCED MICRO DEVICES INC | 1 | 2004 |
| SEMATECH INC | 1 | 1998 |
| YIELD DYNAMICS INC | 1 | 2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| Austin, Texas, US | 77 | 1998–2007 |