Inventor
HIDEFUMI KINDA
Inventor
JP
Overview
Patents· 1 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering25%
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
PatentTitleYear
11,806,805Workpiece cutting method2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023Patents assigned to HAMAMATSU PHOTONICS KK (1)· patent assignee history
2023Patents assigned to KYORITSU CHEMICAL & CO LTD (1)· patent assignee history
2023Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HAMAMATSU PHOTONICS KK | 1 | 2023 |
| KYORITSU CHEMICAL & CO LTD | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 1 | 2023 |