Inventor
William E. Sablinski
Inventor
Beacon, NY, US
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H05KPrinted circuits20%
Y02PClimate change mitigation technologies in the production or processing of goods19%
B23KSoldering or unsoldering14%
Y10TTechnical subjects covered by former us classification13%
C07FAcyclic, carbocyclic or heterocyclic compounds containing elements other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur, selenium or tellurium1%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds1%
C08LCompositions of macromolecular compounds1%
G02BOptical elements, systems or apparatus1%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h101%
PatentTitleYear
7,932,342'Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend system'20117,767,575'Forming robust solder interconnect structures by reducing effects of seed layer underetching'20107,473,997'Method for forming robust solder interconnect structures by reducing effects of seed layer underetching'20096,995,084'Method for forming robust solder interconnect structures by reducing effects of seed layer underetching'20066,892,925'Solder hierarchy for lead free solder joint'20056,854,636'Structure and method for lead free solder electronic package interconnections'20056,827,505'Optoelectronic package structure and process for planar passive optical and optoelectronic devices'20046,740,959'EMI shielding for semiconductor chip carriers'20046,574,859'Interconnection process for module assembly and rework'20036,518,674'Temporary attach article and method for temporary attach of devices to a substrate'20036,429,388'High density column grid array connections and method thereof'20026,303,400'Temporary attach article and method for temporary attach of devices to a substrate'20016,283,359'Method for enhancing fatigue life of ball grid arrays'20016,278,184'Solder disc connection'20016,253,986'Solder disc connection'20016,235,996'Interconnection structure and process module assembly and rework'20016,158,644'Method for enhancing fatigue life of ball grid arrays'20006,070,321'Solder disc connection'20006,070,782'Socketable bump grid array shaped-solder on copper spheres'20005,881,944'Multi-layer solder seal band for semiconductor substrates'19995,881,945'Multi-layer solder seal band for semiconductor substrates and process'19995,868,304'Socketable bump grid array shaped-solder on copper spheres'19995,605,277'Hot vacuum device removal process and apparatus'19975,543,584'Structure for repairing electrical lines'19965,153,408'Method and structure for repairing electrical lines'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–2011Patents assigned to IBM (24)· patent assignee history
1992–2011Based in Beacon, NY, US· patent location history
1997Based in Dutchess County, NY, US· patent location history
2010Patents assigned to TESSERA INTELLECTUAL PROPERTIE (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 24 | 1992–2011 |
| TESSERA INTELLECTUAL PROPERTIE | 1 | 2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Beacon, New York, US | 24 | 1992–2011 |
| Dutchess County, New York, US | 1 | 1997 |