Inventor
Fumitaka Takagi
Inventor
Ogaki, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
Y02PClimate change mitigation technologies in the production or processing of goods17%
Y10TTechnical subjects covered by former us classification17%
H01LSemiconductor devices9%
C23FNon-mechanical removal of metallic material from surface4%
PatentTitleYear
9,480,156'Method for manufacturing printed wiring board'20169,185,806'Method for manufacturing printed wiring board and printed wiring board'20158,927,875'Wiring board and method for manufacturing wiring board'20158,592,691'Printed wiring board'20138,410,374'Printed wiring board'20138,153,905'Method for manufacturing printed wiring board and printed wiring board'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2016Patents assigned to IBIDEN CO LTD (6)· patent assignee history
2012–2016Patents assigned to FURUTA TORU (5)· patent assignee history
2012–2016Patents assigned to TAKAGI FUMITAKA (5)· patent assignee history
2012–2016Patents assigned to IDO MICHIO (4)· patent assignee history
2012–2016Patents assigned to TAKAGI KOTARO (4)· patent assignee history
2012–2016Based in Ogaki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBIDEN CO LTD | 6 | 2012–2016 |
| FURUTA TORU | 5 | 2012–2016 |
| TAKAGI FUMITAKAself | 5 | 2012–2016 |
| IDO MICHIO | 4 | 2012–2016 |
| TAKAGI KOTARO | 4 | 2012–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ogaki, JP | 6 | 2012–2016 |