Inventor

Victor Tan

Inventor
Kirkland, WA, US

Overview

34→
Patents
2004–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 34 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G06Fprimary
G06FElectric digital data processing28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H10DInorganic electric semiconductor devices19%
H04LTransmission of digital information, e.g. telegraphic communication8%
A63FCard, board, or roulette games3%
G06KGraphical data reading3%
G06TImage data processing or generation, in general3%
G08BSignalling systems, e.g. personal calling systems3%
H04NPictorial communication, e.g. television3%
H04WWireless communication networks3%
PatentTitleYear
10,331,891Branch target computation in secure start-up using an integrity datum and an adjustment datum20199,813,403'Securing communications with enhanced media platforms'20179,647,847'Tamper evidence per device protected identity'20179,413,738'Securing communications with enhanced media platforms'20169,262,594'Tamper evidence per device protected identity'20168,726,042'Tamper resistant memory protection'20148,672,231'Integrated circuit system with antenna'20148,661,234'Individualized per device initialization of computing devices in avoidance of mass exploitation of vulnerabilities'20148,656,190'One time settable tamper resistant software repository'20148,373,277'Stacked die in die BGA package'20138,059,137'Compositing desktop window manager'20117,839,419'Compositing desktop window manager'20107,817,163'Dynamic window anatomy'20107,799,610'Method of fabricating a stacked die having a recess in a die BGA package'20107,770,134'Methods and apparatuses for handling single-user applications in multi-user computing environments'20107,575,953'Stacked die with a recess in a die BGA package'20097,552,391'Methods and arrangements for providing multiple concurrent desktops and workspaces in a shared computing environment having remote nodes'20097,444,735'Process for manufacturing an integrated circuit system'20087,389,500'Selective pre-compilation of virtual code to enhance boot time emulator performance'20087,371,608'Method of fabricating a stacked die having a recess in a die BGA package'20087,358,117'Stacked die in die BGA package'20087,344,969'Stacked die in die BGA package'20087,332,819'Stacked die in die BGA package'20087,332,820'Stacked die in die BGA package'20087,309,623'Method of fabricating a stacked die in die BGA package'20077,302,488'Parental controls customization and notification'20077,282,392'Method of fabricating a stacked die in die BGA package'20077,282,390'Stacked die-in-die BGA package with die having a recess'20077,213,054'Methods and apparatuses for handling single-user applications in multi-user computing environments'20077,127,719'Methods and arrangements for providing multiple concurrent desktops and workspaces in a shared computing environment'20067,112,048'BOC BGA package for die with I-shaped bond pad layout'20066,807,666'Methods and arrangements for providing multiple concurrent desktops and workspaces in a shared computing environment'20046,720,666'BOC BGA package for die with I-shaped bond pad layout'20046,692,987'BOC BGA package for die with I-shaped bond pad layout'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2013Patents assigned to MICRON TECHNOLOGY INC (14)· patent assignee history
2004–2014Patents assigned to MICROSOFT CORP (13)· patent assignee history
2004–2019Based in Kirkland, WA, US· patent location history
2004–2014Based in Singapore, SG· patent location history
2011–2019Patents assigned to TAN VICTOR (7)· patent assignee history
2014–2016Patents assigned to LANGE SEBASTIAN (4)· patent assignee history
2016–2019Patents assigned to MICROSOFT TECHNOLOGY LICENSING LLC (5)· patent assignee history
2016–2017Based in Seattle, WA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC142004–2013
MICROSOFT CORP132004–2014
TAN VICTORself72011–2019
MICROSOFT TECHNOLOGY LICENSING LLC52016–2019
LANGE SEBASTIAN42014–2016
Locations
LocationPatentsSpan
Kirkland, Washington, US162004–2019
Singapore, SG162004–2014
Seattle, Washington, US22016–2017