Inventor
Daniel R. Gamota
Inventor
Palatine, IL, US
Overview
Patents· 52 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H05KPrinted circuits13%
H10KOrganic electric solid-state devices12%
Y10TTechnical subjects covered by former us classification8%
A01NPreservation of bodies of humans or animals or plants or parts thereof4%
C02FTreatment of water, waste water, sewage, or sludge3%
H10DInorganic electric semiconductor devices3%
B01DSeparation2%
G02BOptical elements, systems or apparatus2%
H03KPulse technique2%
PatentTitleYear
10,941,051Liquid filter apparatus and system202110,455,831Liquid material systems with multifunctional organometallic additives201910,045,536Antimicrobial polymer systems using multifunctional organometallic additives for polyurethane hosts20189,795,141'Antimicrobial polymer systems using multifunctional organometallic additives for polyurethane hosts'20179,580,334'Liquid purification system'20179,573,828'Liquid purification system'20179,138,000'Antimicrobial polymer systems using multifunctional organometallic additives for wax hosts'20158,318,032'Method to pattern metallized substrates using a high intensity light source'20128,134,233'Method and apparatus for providing electrically isolated closely spaced features on a printed circuit board'20127,780,345'Method and apparatus for a temperature sensor for measuring peak temperatures'20107,686,664'Method of manufacturing customized electroluminescent display'20107,667,285'Printed electronic substrate havine photochromic barrier layer'20107,622,859'Electroluminescent display having a pixel array'20097,550,998'Inverter circuit having a feedback switch and methods corresponding thereto'20097,538,683'Containment mechanism manipulation responsive electrical circuit power usage apparatus and method'20097,492,604'Electronic module interconnection apparatus'20097,474,465'Electrically-responsive lenticular display apparatus and method'20097,461,035'Path determination facilitation method'20087,399,656'Method of fabricating organic field effect transistors'20087,397,372'Method and apparatus for marketing retail goods'20087,393,716'Encapsulated organic semiconductor device and method'20087,355,225'Semiconductor device and method for providing a reduced surface area electrode'20087,244,626'Semiconductor devices shared element(s) apparatus and method'20077,030,666'Organic semiconductor inverting circuit'20066,905,908'Method of fabricating organic field effect transistors'20056,870,181'Organic contact-enhancing layer for organic field effect transistors'20056,868,352'Organic semiconductor product state monitor'20056,806,542'Electronic device having a filled dielectric medium'20046,780,733'Thinned semiconductor wafer and die and corresponding method'20046,677,607'Organic semiconductor device having an oxide layer'20046,661,024'Integrated circuit including field effect transistor and method of manufacture'20036,649,852'Micro-electro mechanical system'20036,603,141'Organic semiconductor and method'20036,585,424'Structure and method for fabricating an electro-rheological lens'20036,570,362'Portable electronic device with enhanced battery life and cooling'20036,562,663'Microelectronic assembly with die support and method'20036,541,300'Semiconductor film and process for its preparation'20036,391,762'Method of forming a microelectronic assembly with a particulate free underfill material and a microelectronic assembly incorporation the same'20026,201,192'Method and assembly for providing improved underchip encapsulation'20016,156,408'Device for reworkable direct chip attachment'20006,108,212'Surface-mount device package having an integral passive component'20006,083,819'Method and assembly for providing improved underchip encapsulation'20006,034,333'Frame embedded in a polymeric encapsulant'20005,930,598'Microelectronic assembly including a decomposable encapsulant, and method for forming and reworking same'19995,912,507'Solderable pad with integral series termination resistor'19995,821,456'Microelectronic assembly including a decomposable encapsulant, and method for forming and reworking same'19985,814,401'Selectively filled adhesive film containing a fluxing agent'19985,804,881'Method and assembly for providing improved underchip encapsulation'19985,720,100'Assembly having a frame embedded in a polymeric encapsulant and method for forming same'19985,704,116'Method of holding a component using an anhydride fluxing agent'19985,682,066'Microelectronic assembly including a transparent encapsulant'19975,552,076'Anhydrous amorphous ceramics as the particulate phase in electrorheological fluids'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–2019Based in Palatine, IL, US· patent location history
1997–2010Patents assigned to MOTOROLA INC (42)· patent assignee history
2012Patents assigned to GAMOTA DANIEL R (2)· patent assignee history
2012Patents assigned to KLOSOWIAK TOMASZ L (2)· patent assignee history
2015–2021Patents assigned to LATELLA RICK (2)· patent assignee history
2017–2019Patents assigned to DMR INT INC (5)· patent assignee history
2017Based in Woodstock, IL, US· patent location history
2018–2021Based in San Jose, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MOTOROLA INC | 42 | 1997–2010 |
| DMR INT INC | 5 | 2017–2019 |
| GAMOTA DANIEL Rself | 2 | 2012 |
| KLOSOWIAK TOMASZ L | 2 | 2012 |
| LATELLA RICK | 2 | 2015–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Palatine, Illinois, US | 49 | 1996–2019 |
| San Jose, California, US | 2 | 2018–2021 |
| Woodstock, Illinois, US | 1 | 2017 |