Inventor
Douglas G. Mitchell
Inventor
Tempe, AZ, US
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H01LSemiconductor devices11%
H05KPrinted circuits8%
H10DInorganic electric semiconductor devices8%
Y10TTechnical subjects covered by former us classification8%
C23FNon-mechanical removal of metallic material from surface4%
C25DProcesses for the electrolytic or electrophoretic production of coatings2%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers2%
Y02PClimate change mitigation technologies in the production or processing of goods2%
PatentTitleYear
9,520,323'Microelectronic packages having trench vias and methods for the manufacture thereof'20169,502,363'Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers'20169,281,293'Microelectronic packages having layered interconnect structures and methods for the manufacture thereof'20169,142,502'Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits'20159,123,685'Microelectronic packages having frontside thermal contacts and methods for the fabrication thereof'20159,018,045'Microelectronic packages and methods for the fabrication thereof'20158,685,790'Semiconductor device package having backside contact and method for manufacturing'20148,283,207'Methods for forming through-substrate conductor filled vias, and electronic assemblies formed using such methods'20128,216,918'Method of forming a packaged semiconductor device'20128,158,492'MEMS microphone with cavity and method therefor'20127,981,730'Integrated conformal shielding method and process using redistributed chip packaging'20117,950,144'Method for controlling warpage in redistributed chip packaging panels'20117,935,571'Through substrate vias for back-side interconnections on very thin semiconductor wafers'20117,425,464'Semiconductor device packaging'20086,878,633'Flip-chip structure and method for high quality inductors and transformers'20056,803,323'Method of forming a component overlying a semiconductor substrate'20046,726,826'Method of manufacturing a semiconductor component'20046,517,698'System and method for providing rotation to plating flow'20036,436,300'Method of manufacturing electronic components'20026,413,878'Method of manufacturing electronic components'20026,372,622'Fine pitch bumping with improved device standoff and bump volume'20026,361,675'Method of manufacturing a semiconductor component and plating tool therefor'20025,773,359'Interconnect system and method of fabrication'19985,480,835'Electrical interconnect and method for forming the same'1996D0328588'Chock block unit'19924,927,505'Metallization scheme providing adhesion and barrier properties'19904,880,708'Metallization scheme providing adhesion and barrier properties'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989–2004Patents assigned to MOTOROLA INC (10)· patent assignee history
1989–2016Based in Tempe, AZ, US· patent location history
1992–2016Patents assigned to MITCHELL DOUGLAS G (11)· patent assignee history
1992Based in Irvine, CA, US· patent location history
2004–2016Patents assigned to FREESCALE SEMICONDUCTOR INC (15)· patent assignee history
2012–2016Patents assigned to GONG ZHIWEI (5)· patent assignee history
2012–2016Patents assigned to HAYES SCOTT M (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FREESCALE SEMICONDUCTOR INC | 15 | 2004–2016 |
| MITCHELL DOUGLAS Gself | 11 | 1992–2016 |
| MOTOROLA INC | 10 | 1989–2004 |
| GONG ZHIWEI | 5 | 2012–2016 |
| HAYES SCOTT M | 5 | 2012–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tempe, AZ, US | 26 | 1989–2016 |
| Irvine, California, US | 1 | 1992 |