Inventor
PHILIP WINTERBOTTOM
Inventor
US
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G02Bprimary
G02BOptical elements, systems or apparatus22%
H04BTransmission17%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein14%
G01KMeasuring temperature13%
G06FElectric digital data processing8%
G06NComputing arrangements based on specific computational models6%
H04JMultiplex communication5%
G11CStatic stores3%
H01LSemiconductor devices3%
H04QSelecting3%
PatentTitleYear
12,566,551Multi-chip electro-photonic networks and photonic memory fabrics for interconnecting multiple circuit packages202612,561,059Multi-chip electro-photonic networks and photonic memory fabrics for interconnecting multiple circuit packages202612,468,103Optically bridged multicomponent package with extended temperature range202512,442,997Optically bridged multicomponent package with extended temperature range202512,443,000Optically bridged multicomponent package with extended temperature range202512,442,998Optically bridged multicomponent package with extended temperature range202512,442,999Optically bridged multicomponent package with extended temperature range202512,436,346Optically bridged multicomponent package with extended temperature range202512,405,434Embedding a photonic integrated circuit in a semiconductor package for high bandwidth memory and compute202512,399,333Optical multi-die interconnect bridge with electrical and optical interfaces202512,392,974Embedding a photonic integrated circuit in a semiconductor package for high bandwidth memory and compute202512,353,006Electro-photonic network for machine learning202512,339,490Clock signal distribution using photonic fabric202512,339,492Electro-photonic network for machine learning202512,298,608Optically bridged multicomponent package with extended temperature range202512,271,595Photonic memory fabric for system memory interconnection202512,259,575Clock signal distribution using photonic fabric202512,242,122Multicomponent photonically intra-die bridged assembly202512,216,318Optical bridging element for separately stacked electrical ICs202512,217,056Load/store unit for a tensor engine and methods for loading or storing a tensor202512,197,023Manufacturing optically accessible co-packaged optics202512,164,162Multicomponent photonically bridged assembly202412,164,161Stacked-dies optically bridged multicomponent package202412,124,095Optical multi-die interconnect bridge with optical interface202411,835,777Optical multi-die interconnect bridge (OMIB)202311,509,397Balanced photonic architectures for matrix computations202211,418,450Upstream channels for distributed CMTS2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to CELESTIAL AI INC (26)· patent assignee history
2022Patents assigned to ALCATEL LUCENT USA INC (1)· patent assignee history
2022Patents assigned to VECIMA NETWORKS INC (1)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CELESTIAL AI INC | 26 | 2022–2026 |
| ALCATEL LUCENT USA INC | 1 | 2022 |
| VECIMA NETWORKS INC | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 27 | 2022–2026 |