Inventor

Meng-Sung Chou

Inventor

New Taipei, TW

Overview

19→

Patents

2012–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 19 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices23%

H10HInorganic light-emitting semiconductor devices having potential barriers23%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%

A61BDiagnosis7%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%

F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted3%

H10DInorganic electric semiconductor devices3%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%

F21KNon-electric light sources using luminescence2%

F21VFunctional features or details of lighting devices or systems thereof2%

PatentTitleYear

10,756,244LED package structure2020 10,720,548Manufacturing method of LED package structure2020 10,686,096Optical sensor module and a wearable device including the same2020 10,490,693LED package structure and manufacturing method thereof2019 10,383,528Wearable apparatus and photoplenthysmography sensor unit thereof2019 10,326,062UV LED package structure, UV light emitting unit, and method for manufacturing UV light emitting unit2019 10,211,360Optical biosensor module and method for making the same2019 10,134,939Optical sensor module and a wearable device including the same2018 9,985,191LED package structure2018 9,978,915Manufacturing method of a flip-chip light emitting diode package module2018 9,812,608'Deep ultraviolet light-emitting diode chip and package structure containing the same'2017 9,490,404'Flip-chip light emitting diode package module and manufacturing method thereof'2016 9,441,817'Light-emitting structure'2016 9,412,724'Chip-scale packaged LED device'2016 9,099,625'LED package and metallic frame thereof'2015 9,018,648'LED package structure'2015 8,890,439'Light-emitting diode circuit and light-emitting device having the same'2014 8,319,245'Lead frame, and light emitting diode module having the same'2012 8,089,140'Lead frame assembly, lead frame and insulating housing combination, and led module having the same'2012

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2012–2020Patents assigned to LITE ON TECHNOLOGY CORP (16)· patent assignee history

2012–2015Patents assigned to CHOU MENG-SUNG (3)· patent assignee history

2012–2020Based in Taipei, TW· patent location history

2014–2018Patents assigned to LITE ON ELECTRONICS GUANGZHOU (4)· patent assignee history

2014–2020Based in New Taipei, TW· patent location history

2018–2020Patents assigned to LITE ON OPTO TECH CHANGZHOU CO LTD (8)· patent assignee history

2018–2020Patents assigned to LITE ON TECH CORP (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
LITE ON TECHNOLOGY CORP	16	2012–2020
LITE ON OPTO TECH CHANGZHOU CO LTD	8	2018–2020
LITE ON ELECTRONICS GUANGZHOU	4	2014–2018
CHOU MENG-SUNGself	3	2012–2015
LITE ON TECH CORP	3	2018–2020

Locations

Location	Patents	Span
New Taipei, TW	11	2014–2020
Taipei, TW	8	2012–2020