Inventor
Shigeru Shoji
Inventor
Tokyo, JP
Overview
Patents· 65 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Rprimary
G01RMeasuring electric variables13%
G11BInformation storage based on relative movement between record carrier and transducer11%
B82YSpecific uses or applications of nanostructures9%
Y10TTechnical subjects covered by former us classification7%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock5%
H01FMagnets5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds3%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
PatentTitleYear
11,052,654Droplet dispensing device20218,835,566'Rubber composition for vulcanization'20148,492,000'Vulcanized rubber laminate'20138,283,039'Vulcanized rubber laminate'20128,258,222'Composition for vulcanized rubber and vulcanization product'20128,004,064'Thin film capacitor'20117,969,149'Magnetic sensor, magnetic direction sensor, method of detecting magnetic field and method of detecting magnetic direction'20117,960,970'Magnetic sensor and manufacturing method of the same'20117,909,604'Root apex position detection apparatus'20117,902,811'Current sensor'20117,868,613'Magnetic sensor and manufacturing method thereof'20117,868,435'Adhesive containing a filler, and a method for attaching and manufacturing a thin plate using the same'20117,737,678'Magnetic sensor and current sensor'20107,723,984'Magnetic sensor and current sensor'20107,723,983'Magnetic sensor and current sensor'20107,679,865'Spring member for acceleration sensor, acceleration sensor and magnetic disk drive apparatus'20107,645,685'Method for producing a thin IC chip using negative pressure'20107,646,196'Current sensor and method of manufacturing current sensor'20107,589,524'Head suspension assembly, rotation detecting mechanism, and conveying mechanism capable of accurately detecting the conveyance amount of an object to be conveyed'20097,589,612'Current sensor'20097,554,325'Magnetic sensor with needle-shaped detecting part'20097,543,498'Spring member for acceleration sensor, acceleration sensor and magnetic disk drive apparatus'20097,523,664'Acceleration sensor and magnetic disk drive apparatus'20097,504,927'Current sensor'20097,503,231'Support of displacement-detection device, sensor support assembly and displacement-detection device'20097,501,928'Current sensor'20097,495,541'Current sensor'20097,463,016'Current sensor'20087,444,871'Acceleration sensor and magnetic disk drive apparatus'20087,444,872'Acceleration sensor and magnetic disk drive apparatus'20087,425,376'Ferrite substrate for thin-film inductors, thin-film common mode filter using the substrate, and thin-film common mode filter array using the substrate'20087,420,785'Suspension assembly, hard disk drive, and method of manufacturing suspension assembly'20087,414,397'Angle switch device with magnetoresistive effect element'20087,403,352'Acceleration sensor and magnetic disk drive apparatus'20087,394,240'Current sensor'20087,392,704'Acceleration sensor and magnetic disk drive apparatus'20087,387,847'Ferrite substrate, thin-film common mode filter using the substrate, thin-film common mode filter array using the substrate and manufacturing method of the substrate'20087,355,261'Thin film device, thin film device module, and method of forming thin film device module'20087,293,345'Method of manufacturing a thin film magnetic recording head'20077,248,045'Magnetic sensing device, method of forming the same, magnetic sensor, and ammeter'20077,247,975'Thin-film piezoelectric element and method of making same'20077,222,535'Acceleration sensor and magnetic disk drive apparatus'20077,219,791'Conveying mechanism'20077,207,099'Method of manufacturing thin-film magnetic head having a magnetism intercepting layer provided between read head and write head'20077,183,696'Thin film piezoelectric element, suspension assembly, and hard disk drive'20077,180,705'Thin film magnetic head capable of reducing expansion and bending of a recording pattern, method of manufacturing the same and magnetic recording apparatus'20077,176,773'High density inductor and method for producing same'20077,147,467'Tooth mobility measuring apparatus'20067,123,442'Thin-film magnetic head and manufacturing method of thin-film magnetic head'20067,098,655'Eddy-current sensor with planar meander exciting coil and spin valve magnetoresistive element for nondestructive testing'20067,078,895'Eddy-current probe'20067,064,629'Thin-film common mode filter and thin-film common mode filter array'20067,040,014'Method of producing a helical coil chip'20067,023,299'Thin-film common mode filter and thin-film common mode filter array'20067,019,948'Thin film magnetic head, magnetic head device and magnetic recording/reproducing device'20067,012,425'Eddy-current probe'20066,984,333'Thin film magnetic head, method of manufacturing the same and magnetic recording apparatus'20066,954,065'Eddy-current probe'20056,882,508'Thin-film magnetic head having a magnetism intercepting layer provided between read head and write head'20056,731,373'Method for imprinting a wafer with identifying information, and exposing method and apparatus for imprinting a wafer with identifying information'20046,512,074'Polymerization catalysts of oxirane compounds and process for preparing polymers of oxirane compounds using the catalysts'20036,239,204'Cross-linked solid polyelectrolyte and use thereof'20016,162,563'Polymer Solid Electrolyte'20005,837,157'Polymer solid electrolyte'19985,636,983'Laser cutting apparatus'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2011Based in Sendai, JP· patent location history
1998–2014Patents assigned to DAISO CO LTD (8)· patent assignee history
2000–2001Based in Hyogo, JP· patent location history
2003–2014Based in Osaka, JP· patent location history
2004–2011Patents assigned to TDK CORP (51)· patent assignee history
2004–2011Based in Tokyo, JP· patent location history
2006–2011Patents assigned to SAE MAGNETICS HK LTD (4)· patent assignee history
2008–2010Based in Chuo-ku, JP· patent location history
2012–2014Patents assigned to FUNAYAMA TOSHIYUKI (4)· patent assignee history
2012–2014Patents assigned to OTAKA TOYOFUMI (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TDK CORP | 51 | 2004–2011 |
| DAISO CO LTD | 8 | 1998–2014 |
| FUNAYAMA TOSHIYUKI | 4 | 2012–2014 |
| OTAKA TOYOFUMI | 4 | 2012–2014 |
| SAE MAGNETICS HK LTD | 4 | 2006–2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 50 | 2004–2011 |
| Osaka, JP | 5 | 2003–2014 |
| Sendai, JP | 3 | 1997–2011 |
| Chuo-ku, JP | 3 | 2008–2010 |
| Hyogo, JP | 2 | 2000–2001 |