Inventor
HIROYUKI SHINOZAKI
Inventor
JP
Overview
Patents· 12 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing23%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H01LSemiconductor devices10%
LOC1010%
Y02PClimate change mitigation technologies in the production or processing of goods10%
B22FWorking metallic powder7%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering7%
B08BCleaning in general3%
B23KSoldering or unsoldering3%
B24DTools for grinding, buffing or sharpening3%
PatentTitleYear
12,459,039AM apparatus for manufacturing a fabricated object and method for testing an irradiation position of a beam in the AM apparatus202512,257,666Surface height measurement method using dummy disk202512,226,825Buffer chamber and AM system including a buffer chamber202512,208,488Coupling mechanism with spherical bearing, method of determining bearing radius of spherical bearing, and substrate polishing apparatus2025D1035468Measurement jig2024D1034248Measurement jig202411,583,973Polishing apparatus202311,472,000Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus202211,472,002Substrate polishing apparatus202211,426,834Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method2022D0954567Measurement jig202211,325,224Method of monitoring a dressing process and polishing apparatus2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to EBARA CORP (12)· patent assignee history
2022–2025Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EBARA CORP | 12 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 12 | 2022–2025 |