Inventor
Shigenori Morita
Inventor
Ibaraki, JP
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices12%
H10KOrganic electric solid-state devices10%
H05BElectric heating7%
H05KPrinted circuits7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
G02BOptical elements, systems or apparatus5%
G11BInformation storage based on relative movement between record carrier and transducer5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution5%
Y02PClimate change mitigation technologies in the production or processing of goods5%
PatentTitleYear
10,126,239Optical waveguide, and SPR sensor cell and colorimetric sensor cell each using same20189,647,224'Method and apparatus for manufacturing organic EL device'20179,516,721'Organic electro-luminescence light-emitting device and production method of the same'20169,331,307'Method for manufacturing organic EL device and organic EL device'20169,147,861'Surface light-emitting object'20159,028,647'Adhesive for polarizing plate, polarizing plate, manufacturing method therefor, optical film and image display'20159,030,098'Wireless electric power supply type light-emitting element and light-emitting device'20158,962,379'Method of producing CIGS film, and method of producing CIGS solar cell by using same'20158,859,032'Organic el device manufacturing method and apparatus'20148,609,236'Adhesive for polarizing plate, polarizing plate, manufacturing method therefor, optical film and image display'20138,247,890'Wiring circuit structure and manufacturing method for semiconductor device using the structure'20128,183,093'Method of manufacturing a semiconductor device by lamination'20128,124,457'Manufacturing method of transferring a wiring circuit layer on a metal support substrate to a semiconductor element'20127,007,379'Production method of printed circuit board'20066,841,737'Wired circuit board'20056,399,899'Suspension board with circuit'20026,380,493'Circuit board'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2018Patents assigned to NITTO DENKO CORP (17)· patent assignee history
2002–2018Based in Ibaraki, JP· patent location history
2005Based in Osaka, JP· patent location history
2012–2017Patents assigned to MORITA SHIGENORI (10)· patent assignee history
2012Patents assigned to ODA TAKASHI (3)· patent assignee history
2014–2016Patents assigned to NAKAI TAKAHIRO (4)· patent assignee history
2015Patents assigned to HOSOKAWA KAZUHITO (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NITTO DENKO CORP | 17 | 2002–2018 |
| MORITA SHIGENORIself | 10 | 2012–2017 |
| NAKAI TAKAHIRO | 4 | 2014–2016 |
| ODA TAKASHI | 3 | 2012 |
| HOSOKAWA KAZUHITO | 2 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ibaraki, JP | 16 | 2002–2018 |
| Osaka, JP | 1 | 2005 |