Inventor
CHRISTOPHER GLANCEY
Inventor
US
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H01LSemiconductor devices36%
H05KPrinted circuits15%
B23KSoldering or unsoldering3%
G01MTesting static or dynamic balance of machines or structures3%
G01RMeasuring electric variables3%
G11CStatic stores3%
PatentTitleYear
12,588,147Filling cracks on a substrate via202612,543,572Semiconductor systems with anti-warpage mechanisms and associated systems, devices, and methods202612,543,261Solder mask fault fiber optics sensor202612,532,775Methods and assemblies for measurement and prediction of package and die strength202612,341,110Methods and apparatus for using structural elements to improve drop/shock resilience in semiconductor devices202512,218,079Semiconductor devices with reinforced substrates202512,211,814Semiconductor interconnect structures with conductive elements, and associated systems and methods202512,211,822Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods202511,869,862Microelectronic components including metal pillars secured to bond pads, and related methods, assemblies, and systems202411,855,002Warpage control in microelectronic packages, and related assemblies and methods202311,769,752Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods202311,728,307Semiconductor interconnect structures with conductive elements, and associated systems and methods202311,664,360Circuit board with spaces for embedding components202311,646,286Processes for forming self-healing solder joints and repair of same, related solder joints, and microelectronic components, assemblies and electronic systems incorporating such solder joints202311,552,029Semiconductor devices with reinforced substrates202311,276,659Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elements2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to MICRON TECHNOLOGY INC (16)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 16 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 16 | 2022–2026 |