Inventor
Shinya Nakaseko
Inventor
Kawasaki, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H05KPrinted circuits17%
Y02PClimate change mitigation technologies in the production or processing of goods11%
Y10TTechnical subjects covered by former us classification11%
H10DInorganic electric semiconductor devices6%
PatentTitleYear
6,541,848'Semiconductor device including stud bumps as external connection terminals'20036,329,711'Semiconductor device and mounting structure'20016,034,428'Semiconductor integrated circuit device having stacked wiring and insulating layers'20005,844,309'Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition'19985,804,467'Semiconductor device and method of producing the same'19985,679,978'Semiconductor device having resin gate hole through substrate for resin encapsulation'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2003Patents assigned to FUJITSU LTD (5)· patent assignee history
1997–2000Patents assigned to KYUSHU FUJITSU ELECTRONIC (3)· patent assignee history
1997–2003Based in Kawasaki, JP· patent location history
1998Patents assigned to FUJISTSU LIMITED (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 5 | 1997–2003 |
| KYUSHU FUJITSU ELECTRONIC | 3 | 1997–2000 |
| FUJISTSU LIMITED | 1 | 1998 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 6 | 1997–2003 |