Inventor

HAO-YI TSAI

Inventor

TW

Overview

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 190 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices31%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%

H10DInorganic electric semiconductor devices4%

G02BOptical elements, systems or apparatus3%

H01FMagnets2%

G06VImage or video recognition or understanding1%

H02JElectric power networks1%

H05KPrinted circuits1%

H01GCapacitors1%

PatentTitleYear

12,575,465Semiconductor package and manufacturing method thereof2026 12,568,827Method for fabricating device die2026 12,566,302Package structure and method of forming the same2026 12,564,089Package structure2026 12,557,707Method of fabricating package structure2026 12,557,681Semiconductor package and method of manufacturing the same2026 12,538,827Semiconductor structure2026 12,525,501Semiconductor device2026 12,512,451Semiconductor package and manufacturing method of the same2025 12,500,200Package structure with conductive patterns in a redistribution layer2025 12,489,064Method for forming mark, packaging method of semiconductor device, and semiconductor device having the mark2025 12,451,417Semiconductor package and manufacturing method thereof2025 12,451,426Conductive traces in semiconductor devices and methods of forming same2025 12,442,995Photonic integrated circuit and package structure2025 12,438,007Staggered metal mesh on backside of device die and method forming same2025 12,431,446Package structure2025 12,418,005Semiconductor package and manufacturing method thereof2025 12,412,852Polymer layers embedded with metal pads for heat dissipation2025 12,412,817Integrated circuit package and method2025 12,406,961Integrated circuit package and method2025 12,406,941Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same2025 12,394,242Fingerprint sensor device and method2025 12,388,060Integrated fan-out packages and methods of forming the same2025 12,381,163Semiconductor package and manufacturing method thereof2025 12,374,592Semiconductor device and manufacturing method thereof2025 12,374,627Method of fabricating semiconductor structure2025 12,368,141IPD modules with flexible connection scheme in packaging2025 12,362,274Package structure and method of forming the same2025 12,360,321Package structure, semiconductor device and method of fabricating the same2025 12,362,329Method of fabricating semiconductor package2025 12,362,270Package structure and method of fabricating the same2025 12,362,283Semiconductor device and method of manufacturing the same2025 12,334,434Package structure and method of forming the same2025 12,322,706Chip package and method of forming the same2025 12,322,696Dual-mode wireless charging device2025 12,300,618Semiconductor device having a heat dissipation structure connected chip package2025 12,300,571Integrated circuit package and method2025 12,300,563Semiconductor package and method of fabricating the same2025 12,288,729Integrated circuit package and method2025 12,278,208Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer2025 12,266,639Method of fabricating semiconductor package2025 12,261,092Semiconductor package and manufacturing method thereof2025 12,261,126Semiconductor package2025 12,260,669Fingerprint sensor in InFO structure and formation method2025 12,255,174Bonding passive devices on active dies to form 3D packages2025 12,255,196Semiconductor package with thermal relaxation block and manufacturing method thereof2025 12,255,184Semiconductor packages and methods of forming the same2025 12,243,681Programmable inductor and methods of manufacture2025 12,222,545Package and method of forming same2025 12,210,200Photonic semiconductor device and method of manufacture2025 12,205,923Semiconductor device, circuit board structure and manufacturing method thereof2025 12,205,860Sensor packages2025 12,199,051Integrated circuit structure and method2025 12,176,282Manufacturing method of semiconductor package2024 12,166,015Semiconductor package and manufacturing method of semiconductor package2024 12,164,158Package having prism structure and manufacturing method thereof2024 12,159,839Semiconductor packages2024 12,159,851Package structure having hollow cylinders and method of fabricating the same2024 12,142,597Integrated fan-out package and the methods of manufacturing2024 12,132,024Semiconductor package and method of manufacturing the same2024 12,125,804Semiconductor package and manufacturing method thereof2024 12,113,022Semiconductor package and manufacturing method of semiconductor package2024 12,105,323Semiconductor package2024 12,100,682Package structure with conductive patterns in a redistribution layer2024 12,080,615Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors2024 12,074,143Integrated circuit package and method2024 12,068,212Package structure with through via extending through redistribution layer and method of manufacturing the same2024 12,058,101Package structure and method of forming the same2024 12,057,405Packages with thick RDLs and thin RDLs stacked alternatingly2024 12,051,666Package structure and manufacturing method of package structure thereof2024 12,040,283Method of fabricating semiconductor structure2024 12,027,494Semiconductor device and manufacturing method thereof2024 12,015,017Package structure, package-on-package structure and method of fabricating the same2024 12,014,976Chip package structure including a silicon substrate interposer and methods for forming the same2024 12,014,979Methods of forming semiconductor packages2024 12,009,322Package structure with through-via in molding compound and dielectric layer2024 12,009,281Package structure and method of manufacturing the same2024 12,002,768Semiconductor package and manufacturing method thereof2024 12,002,799Die stacking structure and method forming same2024 11,996,227Hexagonal semiconductor package structure2024 11,990,381Integrated circuit packages having support rings2024 11,953,740Package structure2024 11,948,862Package structures and method of forming the same2024 11,947,173Photonic semiconductor device and method of manufacture2024 11,942,451Semiconductor structure and method of forming the same2024 11,935,804Integrated circuit package and method2024 11,935,871Semiconductor package and method of fabricating the same2024 11,929,318Package structure and method of forming the same2024 11,923,349Semiconductor structures2024 11,923,318Method of manufacturing semiconductor package2024 11,916,025Device die and method for fabricating the same2024 11,894,299Conductive traces in semiconductor devices and methods of forming same2024 11,894,330Methods of manufacturing a semiconductor device including a joint adjacent to a post2024 11,855,016Semiconductor device and method of manufacture2023 11,855,232Semiconductor package and forming method thereof2023 11,854,986Chamfered die of semiconductor package and method for forming the same2023 11,847,852Manufacturing method of fingerprint sensor2023 11,848,233Semiconductor package and manufacturing method thereof2023 11,848,288Semiconductor device and method2023 11,848,319Multi-chip semiconductor package2023 11,848,300Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer2023 11,842,993Semiconductor device with multiple polarity groups2023 11,837,575Bonding passive devices on active device dies to form 3D packages2023 11,837,517Packaged semiconductor devices with wireless charging means2023 11,830,866Semiconductor package with thermal relaxation block and manufacturing method thereof2023 11,830,796Circuit substrate, package structure and method of manufacturing the same2023 11,823,980Package structure and manufacturing method thereof2023 11,824,017Semiconductor package and manufacturing method thereof2023 11,809,000Photonic integrated circuit and package structure2023 11,804,443Segregated power and ground design for yield improvement2023 11,798,925IPD modules with flexible connection scheme in packaging2023 11,768,338Optical interconnect structure, package structure and fabricating method thereof2023 11,764,171Integrated circuit structure and method2023 11,756,731Programmable inductor2023 11,754,780Semiconductor package and manufacturing method thereof2023 11,749,582Package structure2023 11,749,640Semiconductor package and method of manufacturing the same2023 11,742,254Sensor package and method2023 11,741,737Fingerprint sensor in info structure and formation method2023 11,735,518Dual-mode wireless charging device2023 11,727,714Fingerprint sensor device and method2023 11,694,966Chip package and method of forming the same2023 11,694,943Semiconductor device including heat dissipation structure and fabricating method of the same2023 11,686,908Photonic semiconductor device and method of manufacture2023 11,682,626Chamfered die of semiconductor package and method for forming the same2023 11,682,655Semiconductor packages and methods of forming the same2023 11,664,315Structure with interconnection die and method of making same2023 11,664,325Semiconductor structure and method of fabricating the same2023 11,646,255Chip package structure including a silicon substrate interposer and methods for forming the same2023 11,646,296Semiconductor package and manufacturing method of semiconductor package2023 11,640,935Semiconductor package and manufacturing method thereof2023 11,635,566Package and method of forming same2023 11,631,658Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device2023 11,626,339Integrated circuit package and method2023 11,625,940Fingerprint sensor device and method2023 11,614,592Semiconductor devices and methods of manufacture2023 11,600,431InFO coil on metal plate with slot2023 11,594,460Semiconductor package and method of fabricating the same2023 11,580,767Fingerprint sensor2023 11,569,202Semiconductor device, circuit board structure and manufacturing method thereof2023 11,538,735Method of forming integrated circuit packages with mechanical braces2022 11,538,788Integrated fan-out stacked package with fan-out redistribution layer (RDL)2022 11,532,529Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors2022 11,532,425Hexagonal semiconductor package structure2022 11,532,596Package structure and method of forming the same2022 11,532,594Integrated fan-out package and the methods of manufacturing2022 11,527,525Semiconductor device with multiple polarity groups2022 11,521,959Die stacking structure and method forming same2022 11,515,268Semiconductor package and manufacturing method thereof2022 11,506,843Semiconductor device having photonic and electronic dies and an optical fiber assembly creating an air gap2022 11,508,665Packages with thick RDLs and thin RDLs stacked alternatingly2022 11,508,671Semiconductor package and manufacturing method thereof2022 11,508,656Semiconductor package and method2022 11,502,013Integrated circuit package and method2022 11,502,039Semiconductor package and method2022 11,495,590Multi-chip semiconductor package2022 11,488,897Integrated circuit package and method2022 11,444,002Package structure2022 11,424,213Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure2022 11,417,638Semiconductor structures2022 11,417,633Integrated circuit package and method2022 11,417,610Post-passivation interconnect structure2022 11,410,932Semiconductor device and method of manufacturing the same2022 11,398,440Polymer layers embedded with metal pads for heat dissipation2022 11,374,136Semiconductor package and forming method thereof2022 11,355,466Package structure and manufacturing method of package structure thereof2022 11,342,295Electronic assembly, package structure having hollow cylinders and method of fabricating the same2022 11,322,421Package structure and method of forming the same2022 11,309,294Integrated fan-out packages and methods of forming the same2022 11,309,302Manufacturing method of semiconductor package including thermal conductive block2022 11,309,225Fan-out package structure and method of manufacturing the same2022 11,289,373Semiconductor package and manufacturing method thereof2022 11,282,791Semiconductor device having a heat dissipation structure connected chip package2022 11,282,785Wireless charging package with chip integrated in coil center2022 11,251,141Package structure2022 11,251,119Package structure, package-on-package structure and method of fabricating the same2022 11,251,644Packaged semiconductor devices with wireless charging means2022 11,244,906Semiconductor structure and method of fabricating the same2022 11,239,135Package structure and method of manufacturing the same2022 11,211,346Semiconductor device and method of manufacture2021 11,205,636Semiconductor package and method of manufacturing the same2021 11,201,118Chip package and method of forming the same2021 11,194,990Fingerprint sensor device and method2021 11,183,487Integrated circuit package and method2021 11,177,192Semiconductor device including heat dissipation structure and fabricating method of the same2021 11,177,355Semiconductor structure and manufacturing method thereof2021 11,164,819Semiconductor package and manufacturing method thereof2021 11,158,555Package structure having sensor die with touch sensing electrode, and method of fabricating the same2021 11,158,576Package structure having redistribution layer structures2021 11,139,249Semiconductor devices and methods of forming the same2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (190)· patent assignee history

2021–2026Based in TW· patent location history

2024Patents assigned to TAIWAN SEMICONDUCTOR LTD (1)· patent assignee history

2025Patents assigned to TAIWAN SEMICONDUCTOR MFG LTD (1)· patent assignee history

2025Patents assigned to TAIWNA SEMICONDUCTOR MFG COMPANY LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	190	2021–2026
TAIWAN SEMICONDUCTOR LTD	1	2024
TAIWAN SEMICONDUCTOR MFG LTD	1	2025
TAIWNA SEMICONDUCTOR MFG COMPANY LTD	1	2025

Locations

Location	Patents	Span
TW	190	2021–2026