Inventor
Yasuji Hara
Inventor
Ageo, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C25Dprimary
C25DProcesses for the electrolytic or electrophoretic production of coatings33%
H05KPrinted circuits27%
Y10TTechnical subjects covered by former us classification27%
C23CCoating metallic material7%
C25CProcesses for the electrolytic production, recovery or refining of metals7%
PatentTitleYear
6,984,456'Flexible printed wiring board for chip-on flexibles'20066,652,725'Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus'20036,444,112'Manufacturing method of electrodeposited copper foil'20026,194,056'High tensile strength electrodeposited copper foil'20015,958,209'High tensile strength electrodeposited copper foil and process of electrodepositing thereof'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2006Patents assigned to MITSUI MINING & SMELTING CO (5)· patent assignee history
1999–2006Based in Ageo, JP· patent location history
2002Based in Omiya, JP· patent location history
2003Patents assigned to SMELTING CO (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUI MINING & SMELTING CO | 5 | 1999–2006 |
| SMELTING CO | 1 | 2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ageo, JP | 4 | 1999–2006 |
| Omiya, JP | 1 | 2002 |