Inventor
Takeo Ogihara
Inventor
Tokyo, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1075%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests13%
PatentTitleYear
6,011,303'Electronic component'20005,970,322'Ultrahigh-frequency electronic component and method of manufacturing the same'19995,956,574'Lead frame flash removing method and apparatus'19995,905,301'Mold package for sealing a chip'19995,904,501'Hollow package manufacturing method'19995,889,232'Ultrahigh-frequency electronic component'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2000Patents assigned to NEC CORP (6)· patent assignee history
1999–2000Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NEC CORP | 6 | 1999–2000 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 6 | 1999–2000 |