Inventor
Nobuyuki Tamura
Inventor
Tokyo, JP
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B29Cprimary
B29CShaping or joining of plastics15%
B29LIndexing scheme associated with subclass b29c, relating to particular articles12%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts7%
H10BElectronic memory devices7%
G11CStatic stores5%
H01RElectrically-conductive connections5%
H04LTransmission of digital information, e.g. telegraphic communication5%
H10DInorganic electric semiconductor devices5%
B29DProducing particular articles from plastics or from substances in a plastic state3%
B60GVehicle suspension arrangements3%
PatentTitleYear
10,493,684Composite container manufacturing method, molding die, and composite container201910,347,997Terminal-equipped electrical wire and wire harness using the same201910,305,210Terminal plating material, and terminal, terminal-equipped electric wire and wire harness using the same201910,189,594Method for manufacturing a container containing a content fluid, a method for placing an inside of a container under a positive pressure, a filled container, a blow molding method, and a blow molding device201910,186,795Electrical contact member, plated terminal, terminal-attached electrical wire, and wire harness20199,789,641'Blow molding device and method for manufacturing a container'20179,713,899'Blow molding device'20179,610,744'Blow molding device and a method for manufacturing a container'20179,579,841'Blow molding device'20179,555,574'Blow molding device and a method for manufacturing a blow molded container'20179,421,708'Blow molding device'20169,180,621'Blow molding device'20157,812,374'Semiconductor device and fabrication method thereof'20107,577,098'Device and method for network monitoring'20097,350,779'Strut mount'20087,271,414'Semiconductor device and method for fabricating the same'20077,050,434'Digital transmission apparatus for transmitting asynchronous frames by accomodating them in synchronous frames'20067,018,890'Non-volatile semiconductor memory device and manufacturing method thereof'20066,992,977'Transmission apparatus and a method for transmitting data in a data transmission system'20066,655,666'Liquid-sealed vibration-proof device'20036,657,893'Nonvolatile semiconductor memory device and method for driving the same'20036,472,281'Method for fabricating semiconductor device using a CVD insulator film'20026,377,490'Nonvolatile semiconductor memory device and method for driving the same'20026,169,307'Nonvolatile semiconductor memory device comprising a memory transistor, a select transistor, and an intermediate diffusion layer'20015,737,010'System for connection and disconnection in multipoint conference system of cascade configuration'19985,085,444'Dust seal for sliding type bush'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–2009Patents assigned to FUJITSU LTD (4)· patent assignee history
2001–2002Patents assigned to MATSUSHITA ELECTRONICS CORP (2)· patent assignee history
2001–2008Based in Osaka, JP· patent location history
2003–2007Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (3)· patent assignee history
2006–2010Based in Kyoto, JP· patent location history
2006–2009Based in Yokohama, JP· patent location history
2015–2019Patents assigned to DISCMA AG (8)· patent assignee history
2015–2019Based in Tokyo, JP· patent location history
2019Patents assigned to YAZAKI CORP (3)· patent assignee history
2019Based in Shizuoka, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DISCMA AG | 8 | 2015–2019 |
| FUJITSU LTD | 4 | 1998–2009 |
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 3 | 2003–2007 |
| YAZAKI CORP | 3 | 2019 |
| MATSUSHITA ELECTRONICS CORP | 2 | 2001–2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 8 | 2015–2019 |
| Osaka, JP | 6 | 2001–2008 |
| Shizuoka, JP | 3 | 2019 |
| Kyoto, JP | 3 | 2006–2010 |
| Yokohama, JP | 3 | 2006–2009 |