Inventor
MAYANK MAYUKH
Inventor
US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices35%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
C09KMaterials for miscellaneous applications, not provided for elsewhere6%
G02BOptical elements, systems or apparatus6%
H01PWaveguides6%
H01QAntennas, i.e. radio aerials6%
H05KPrinted circuits6%
PatentTitleYear
12,593,726Semiconductor package with side wall interconnection202612,588,506Stacked semiconductor method and apparatus202612,525,495Mixed dielectric materials for improving signal integrity of integrated electronics packages202612,463,319Integrated antennas on side wall of 3D stacked die202512,438,062Polymerized thermal interface material with surface modified liquid metal spheres and method of making202512,191,243Cantilevered power planes to provide a return current path for high-speed signals202511,906,802Photonics integration in semiconductor packages2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024–2026Patents assigned to AVAGO TECH INT SALES PTE LID (7)· patent assignee history
2024–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AVAGO TECH INT SALES PTE LID | 7 | 2024–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2024–2026 |