Inventor
MASAO TOMIKAWA
Inventor
JP
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds10%
C08LCompositions of macromolecular compounds10%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
C03CChemical composition of glasses, glazes or vitreous enamels5%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds5%
C09DCoating compositions, e.g. paints, varnishes or lacquers5%
C09JAdhesives5%
PatentTitleYear
12,534,399Laminate and manufacturing method of semiconductor device202611,640,110Resin composition, method for producing heat-resistant resin film, and display device202311,279,802Alkali-soluble resin, photosensitive resin composition, photosensitive sheet, cured film, interlayer insulating film or semiconductor protective film, production method for relief pattern of cured film, and electronic component or semiconductor device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TORAY INDUSTRIES (3)· patent assignee history
2022–2026Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TORAY INDUSTRIES | 3 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 3 | 2022–2026 |