Inventor
Kimberley A. Kelly
Inventor
Poughkeepsie, NY, US
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits24%
Y10TTechnical subjects covered by former us classification20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form7%
B23KSoldering or unsoldering4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
PatentTitleYear
6,678,949'Process for forming a multi-level thin-film electronic packaging structure'20046,632,314'Method of making a lamination and surface planarization for multilayer thin film interconnect'20036,455,331'Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices'20026,448,169'Apparatus and method for use in manufacturing semiconductor devices'20026,331,731'Column for module component'20016,281,452'Multi-level thin-film electronic packaging structure and related method'20016,248,599'Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices'20016,183,588'Process for transferring a thin-film structure to a substrate'20016,149,048'Apparatus and method for use in manufacturing semiconductor devices'20006,143,117'Process for transferring a thin-film structure to a temporary carrier'20006,099,935'Apparatus for providing solder interconnections to semiconductor and electronic packaging devices'20006,048,741'Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices'20006,036,809'Process for releasing a thin-film structure from a substrate'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2004Patents assigned to IBM (13)· patent assignee history
2000–2004Based in Poughkeepsie, NY, US· patent location history
2003Based in Pleasant Valley, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 13 | 2000–2004 |
Locations
| Location | Patents | Span |
|---|---|---|
| Poughkeepsie, New York, US | 12 | 2000–2004 |
| Pleasant Valley, New York, US | 1 | 2003 |