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Inventor

YURIKA MUNEKAWA

Inventor
JP

Overview

2→
Patents
2023–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering25%
H05KPrinted circuits25%
C22CAlloys13%
H01LSemiconductor devices13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
Y02PClimate change mitigation technologies in the production or processing of goods13%
PatentTitleYear
12,454,030Solder composition and method for manufacturing flexible circuit board202511,724,341Lead-free solder alloy, solder joining material, electronic circuit mounting substrate, and electronic control device2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023–2025Patents assigned to TAMURA SEISAKUSHO KK (2)· patent assignee history
2023–2025Based in JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAMURA SEISAKUSHO KK22023–2025
Locations
LocationPatentsSpan
JP22023–2025