Inventor
Pankaj Dixit
Inventor
San Jose, CA, US
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1045%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests23%
G06FElectric digital data processing13%
H10DInorganic electric semiconductor devices10%
Y10TTechnical subjects covered by former us classification6%
H04LTransmission of digital information, e.g. telegraphic communication3%
PatentTitleYear
10,558,576Storage device with rapid overlay access20209,959,148Method and device for estimating optimal resources for server virtualization20187,096,447'Method and apparatus for efficiently locating and automatically correcting certain violations in a complex existing circuit layout'20066,608,335'Grounded fill in a large scale integrated circuit'20036,499,135'Computer aided design flow to locate grounded fill in a large scale integrated circuit'20025,670,419'Method of fabricating antifuses in an integrated circuit device and resulting structure'19975,527,745'Method of fabricating antifuses in an integrated circuit device and resulting structure'19965,493,147'Antifuse circuit structure for use in a field programmable gate array and method of manufacture thereof'19965,384,481'Antifuse circuit structure for use in a field programmable gate array and method of manufacture thereof'19955,329,153'Antifuse with nonstoichiometric tin layer and method of manufacture thereof'19945,322,812'Improved method of fabricating antifuses in an integrated circuit device and resulting structure'19945,233,217'Plug contact with antifuse'19935,192,715'Process for avoiding spin-on-glass cracking in high aspect ratio cavities'19935,119,164'Avoiding spin-on-glass cracking in high aspect ratio cavities'19924,962,060'Making a high speed interconnect system with refractory non-dogbone contacts and an active electromigration suppression mechanism'19904,960,732'Contact plug and interconnect employing a barrier lining and a backfilled conductor material'19904,884,123'Contact plug and interconnect employing a barrier lining and a backfilled conductor material'19894,847,674'High speed interconnect system with refractory non-dogbone contacts and an active electromigration suppression mechanism'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989–1993Patents assigned to ADVANCED MICRO DEVICES INC (6)· patent assignee history
1989–1990Based in Sunnyvale, CA, US· patent location history
1992–1997Based in San Jose, CA, US· patent location history
1993Patents assigned to CROSSPOINT SOLUTIONS (1)· patent assignee history
1994–1997Patents assigned to CROSSPOINT SOLUTIONS INC (6)· patent assignee history
2002–2006Patents assigned to SUN MICROSYSTEMS INC (3)· patent assignee history
2002–2006Based in Mountain View, CA, US· patent location history
2018Patents assigned to DIXIT Pankaj Mohan (1)· patent assignee history
2018Based in New Delhi, IN· patent location history
2020Based in Bangalore, IN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED MICRO DEVICES INC | 6 | 1989–1993 |
| CROSSPOINT SOLUTIONS INC | 6 | 1994–1997 |
| SUN MICROSYSTEMS INC | 3 | 2002–2006 |
| CROSSPOINT SOLUTIONS | 1 | 1993 |
| DIXIT Pankaj Mohanself | 1 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 9 | 1992–1997 |
| Sunnyvale, California, US | 4 | 1989–1990 |
| Mountain View, California, US | 3 | 2002–2006 |
| Bangalore, IN | 1 | 2020 |
| New Delhi, IN | 1 | 2018 |