Inventor
Naomi Masuda
Inventor
Kanagawa, JP
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1037%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
H01LSemiconductor devices12%
H10DInorganic electric semiconductor devices10%
Y10TTechnical subjects covered by former us classification8%
H05KPrinted circuits4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds2%
D01FChemical features in the manufacture of artificial filaments, threads, fibres, bristles or ribbons2%
PatentTitleYear
9,437,573'Semiconductor device and method for manufacturing thereof'20169,418,940'Structures and methods for stack type semiconductor packaging'20169,385,014'Flip-chip package covered with tape'20169,362,173'Method for chip package'20169,293,441'Semiconductor device and method of manufacturing the same'20168,883,627'Method for chip packaging'20148,796,864'Flip chip bonded semiconductor device with shelf'20148,765,529'Semiconductor device and method for manufacturing the same'20148,637,986'Semiconductor device and method for manufacturing thereof'20148,598,717'Semiconductor device and method for manufacturing the same'20138,486,756'Flip chip bonded semiconductor device with shelf and method of manufacturing thereof'20138,446,015'Semiconductor device and method for manufacturing thereof'20138,274,158'Structure, method and system for assessing bonding of electrodes in FCB packaging'20128,030,179'Semiconductor device and method of manufacturing the same'20117,892,892'Semiconductor device and method for manufacturing thereof'20117,846,780'Flip-chip package covered with tape'20107,816,788'Structure, method and system for assessing bonding of electrodes in FCB packaging'20107,605,457'Semiconductor device and method of manufacturing the same'20095,053,464'Polyurethane containing metal phthalocyanine in the main chain'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991Based in Shizuoka, JP· patent location history
2009–2014Patents assigned to SPANSION LLC (12)· patent assignee history
2009–2016Based in Kanagawa, JP· patent location history
2010–2013Based in Yokohama, JP· patent location history
2012–2016Patents assigned to MASUDA NAOMI (10)· patent assignee history
2014–2016Patents assigned to FUKUYAMA RYOTA (3)· patent assignee history
2014–2016Patents assigned to HOSHINO MASATAKA (3)· patent assignee history
2014–2016Based in Jiangsu, CN· patent location history
2014Based in Tokyo, JP· patent location history
2016Patents assigned to CYPRESS SEMICONDUCTOR CORP (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SPANSION LLC | 12 | 2009–2014 |
| MASUDA NAOMIself | 10 | 2012–2016 |
| CYPRESS SEMICONDUCTOR CORP | 4 | 2016 |
| FUKUYAMA RYOTA | 3 | 2014–2016 |
| HOSHINO MASATAKA | 3 | 2014–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 12 | 2009–2016 |
| Yokohama, JP | 3 | 2010–2013 |
| Jiangsu, CN | 2 | 2014–2016 |
| Tokyo, JP | 1 | 2014 |
| Shizuoka, JP | 1 | 1991 |