Inventor
Yoshiaki Morishita
Inventor
Kanagawa, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1044%
G01RMeasuring electric variables11%
G02BOptical elements, systems or apparatus11%
G11CStatic stores11%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light11%
LOC2811%
PatentTitleYear
7,504,701'Optical unit featuring both photoelectric conversion chip and semiconductor chip wrapped with flexible sheet'20097,501,707'Multichip semiconductor package'20097,400,134'Integrated circuit device with multiple chips in one package'20086,392,292'Multi-level stacked semiconductor bear chips with the same electrode pad patterns'2002D0416356'Container'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999Patents assigned to PROCTER & GAMBLE (1)· patent assignee history
1999Based in Ashiya, JP· patent location history
2002–2009Patents assigned to NEC CORP (2)· patent assignee history
2002Based in Tokyo, JP· patent location history
2008–2009Patents assigned to NEC ELECTRONICS CORP (3)· patent assignee history
2008–2009Based in Kanagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NEC ELECTRONICS CORP | 3 | 2008–2009 |
| NEC CORP | 2 | 2002–2009 |
| PROCTER & GAMBLE | 1 | 1999 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 3 | 2008–2009 |
| Tokyo, JP | 1 | 2002 |
| Ashiya, JP | 1 | 1999 |