Inventor
Liang-Yueh Ou Yang
Inventor
New Taipei, TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices24%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H10DInorganic electric semiconductor devices21%
H01JElectric discharge tubes or discharge lamps5%
C25DProcesses for the electrolytic or electrophoretic production of coatings3%
PatentTitleYear
10,879,114Conductive fill202010,872,815Conductive interconnect structures in integrated circuits202010,867,845Semiconductor device and method202010,636,702Conductive interconnect structures in integrated circuits202010,497,615Semiconductor device and method201910,483,165Methods for forming contact plugs with reduced corrosion201910,186,456Methods for forming contact plugs with reduced corrosion201910,157,785Semiconductor device and method20189,786,604'Metal cap apparatus and method'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (9)· patent assignee history
2017Based in Hsinchu, TW· patent location history
2018Based in Taipei, TW· patent location history
2019–2020Based in New Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 9 | 2017–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| New Taipei, TW | 7 | 2019–2020 |
| Taipei, TW | 1 | 2018 |
| Hsinchu, TW | 1 | 2017 |