Inventor

William L. Guthrie

Inventor

Saratoga, CA, US

Overview

25→

Patents

1987–2018

Patent span

Performing operations

Primary field (CPC B)

Patents· 25 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary

B24BMachines, devices, or processes for grinding or polishing23%

G01BMeasuring length, thickness or similar linear dimensions16%

B24DTools for grinding, buffing or sharpening12%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%

G06FElectric digital data processing9%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%

C09GPolishing compositions4%

G11BInformation storage based on relative movement between record carrier and transducer4%

H05KPrinted circuits4%

B24CAbrasive or related blasting with particulate material2%

PatentTitleYear

10,101,918Systems and methods for generating hint information associated with a host command2018 9,824,007'Data integrity enhancement to protect against returning old versions of data'2017 9,817,752'Data integrity enhancement to protect against returning old versions of data'2017 8,949,491'Buffer memory reservation techniques for use with a NAND flash memory'2015 8,364,992'Method and system for reducing power consumption by command selection in a hard disk drive'2013 7,255,629'Polishing assembly with a window'2007 7,118,450'Polishing pad with window and method of fabricating a window in a polishing pad'2006 7,011,565'Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus'2006 6,910,944'Method of forming a transparent window in a polishing pad'2005 6,632,377'Chemical-mechanical planarization of metallurgy'2003 6,280,290'Method of forming a transparent window in a polishing pad'2001 6,280,297'Apparatus and method for distribution of slurry in a chemical mechanical polishing system'2001 6,131,271'Method of planarizing first pole piece layer of write head by lapping without delamination of first pole piece layer from wafer substrate'2000 6,051,499'Apparatus and method for distribution of slurry in a chemical mechanical polishing system'2000 6,045,439'Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus'2000 6,020,264'Method and apparatus for in-line oxide thickness determination in chemical-mechanical polishing'2000 5,893,796'Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus'1999 5,795,215'Method and apparatus for using a retaining ring to control the edge effect'1998 5,709,593'Apparatus and method for distribution of slurry in a chemical mechanical polishing system'1998 5,633,195'Laser planarization of zone 1 deposited metal films for submicron metal interconnects'1997 5,337,015'In-situ endpoint detection method and apparatus for chemical-mechanical polishing using low amplitude input voltage'1994 4,954,142'Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor'1990 4,944,836'Chem-mech polishing method for producing coplanar metal/insulator films on a substrate'1990 4,789,648'Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias'1988 4,702,792'Method of forming fine conductive lines, patterns and connectors'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1987–2003Patents assigned to IBM (9)· patent assignee history

1987–1997Based in Hopewell Junction, NY, US· patent location history

1990Based in Poughkeepsie, NY, US· patent location history

1998–2007Patents assigned to APPLIED MATERIALS INC (11)· patent assignee history

1998–2007Based in Saratoga, CA, US· patent location history

2013Patents assigned to GUTHRIE WILLIAM (1)· patent assignee history

2013Based in San Jose, CA, US· patent location history

2015–2018Patents assigned to SANDISK TECHNOLOGIES INC (2)· patent assignee history

2015–2018Based in Santa Cruz, CA, US· patent location history

2017–2018Patents assigned to SANDISK TECHNOLOGIES LLC (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
APPLIED MATERIALS INC	11	1998–2007
IBM	9	1987–2003
SANDISK TECHNOLOGIES LLC	3	2017–2018
SANDISK TECHNOLOGIES INC	2	2015–2018
GUTHRIE WILLIAMself	1	2013

Locations

Location	Patents	Span
Saratoga, California, US	14	1998–2007
Hopewell Junction, New York, US	5	1987–1997
Santa Cruz, California, US	4	2015–2018
San Jose, California, US	1	2013
Poughkeepsie, New York, US	1	1990