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Inventor

Seiji Izawa

Inventor
Ibi-gun, JP

Overview

2→
Patents
2012–2015
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
Y10TTechnical subjects covered by former us classification29%
H01LSemiconductor devices14%
PatentTitleYear
8,966,750'Method of manufacturing a multilayered printed wiring board'20158,242,379'Multilayered printed wiring board with a multilayered core substrate'2012

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2012–2015Patents assigned to FUJII NAOAKI (2)· patent assignee history
2012–2015Patents assigned to IBIDEN CO LTD (2)· patent assignee history
2012–2015Patents assigned to IKEDA TOMOYUKI (2)· patent assignee history
2012–2015Patents assigned to IZAWA SEIJI (2)· patent assignee history
2012–2015Based in Ibi-gun, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FUJII NAOAKI22012–2015
IBIDEN CO LTD22012–2015
IKEDA TOMOYUKI22012–2015
IZAWA SEIJIself22012–2015
Locations
LocationPatentsSpan
Ibi-gun, JP22012–2015